From a recycling point of view this is rather boring, but then, recycling is one field of technology in which the Americans lag several decades behind the rest of the world. In Europe, people are already marketing printed circuit foil (1.0 to 2.0 mm thick), which can be applied to any rigid board (wood or metal, for instance) for the purpose of stabilisation and completely removed afterwards.
Refer to this link: http://www.tu-dresden.de/presse/pi/messen-archiv.h tm#TWINflex
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From a recycling point of view this is rather boring, but then, recycling is one field of technology in which the Americans lag several decades behind the rest of the world. In Europe, people are already marketing printed circuit foil (1.0 to 2.0 mm thick), which can be applied to any rigid board (wood or metal, for instance) for the purpose of stabilisation and completely removed afterwards. Refer to this link: http://www.tu-dresden.de/presse/pi/messen-archiv.h tm#TWINflex