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BGA (Ball Grid Array) is chip package with the blobs of solder under it. Flip chip is putting the silicon wafer on the surface of the package, to aid cooling. BGA chips are often flip chip and a common one in use is the Power PC chip
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BGA (Ball Grid Array) is chip package with the blobs of solder under it. Flip chip is putting the silicon wafer on the surface of the package, to aid cooling. BGA chips are often flip chip and a common one in use is the Power PC chip