Actually, that's not true.. That's the whole point of those.. well, definately not ht whole point.. but a big one.. the lenses cost thousands, if not millions, to manufacture.. they have to be essentially FLAWLESS.. They also must not be affected by unavoidable effects such as gravity... when you're talking about nanometers, the bow on the lens caused by gravity is very large.
http://216.239.41.104/search?q=cache:PfSYNDpv4bYJ: oemagazine.com/newscast/2004/020404_newscast01.htm l+immersion+lithography+rochester+institute+of+tec hnology&hl=en&lr=lang_en&ie=UTF-8
http://biz.yahoo.com/prnews/040218/nyw086_1.html
http://216.239.41.104/search?q=cache:Lurb_nMoW6YJ: www.siliconstrategies.com/story/OEG20030227S0068+i mmersion+lithography&hl=en&lr=lang_en&ie=UTF-8
http://www.future-fab.com/document.asp?d_id=1896
Btw, the last article is written by Dr Bruce Smith (the man who's been working on this). It goes into a lot of coverage of the new methods of microlithography....
The most important part of this process, which no one seems to understand, is not that chips can get smaller.. But that chips can get smaller using the CURRENT TECHNOLOGIES. You don't have to move on to new lasers, but you can use the ucrrent 193nm and 157nm lithography and achieve much better resolutions. The process is still VERY hard to achieve at high yield, but that will change with more research.
RIT isn't touting some great leap in processor performance, but a big leap in the way things are done using lithography in the industry.
Actually, it uses pretty much the same machiens that conventional lithography does.. It just incorporates a new part to the entire tool.. I'll post some better links after i'm finished responding to a few of these comments...
Clean rooms will never go away.. You are working with such incredibly small sizes that the smallest number of particles in the air or on your machines will destroy all your work.
Actually, it is MUCH harder to get it right using immersion lithography... It is one of the biggest issues Dr Smith and his affiliates are workign with right now.. Bubbles and other artifacts in the water will cause the wafer to be useless.
The problem with using other materials is that they must be transparent not to light (what we can see) but to UV and other radiation.. If it's not, you might as well be putting lead between the wafer and the mask.
Slashdot Mirror
Actually, that's not true.. That's the whole point of those.. well, definately not ht whole point.. but a big one.. the lenses cost thousands, if not millions, to manufacture.. they have to be essentially FLAWLESS.. They also must not be affected by unavoidable effects such as gravity... when you're talking about nanometers, the bow on the lens caused by gravity is very large.
Cuz we're a learning school and not a research school? :)
If you were MicroE, like myself, you would have...
http://biz.yahoo.com/prnews/040218/nyw086_1.html
http://216.239.41.104/search?q=cache:Lurb_nMoW6YJ: www.siliconstrategies.com/story/OEG20030227S0068+i mmersion+lithography&hl=en&lr=lang_en&ie=UTF-8
http://www.future-fab.com/document.asp?d_id=1896
http://216.239.41.104/search?q=cache:PfSYNDpv4bYJ: oemagazine.com/newscast/2004/020404_newscast01.htm l+immersion+lithography+rochester+institute+of+tec hnology&hl=en&lr=lang_en&ie=UTF-8
http://biz.yahoo.com/prnews/040218/nyw086_1.html
http://216.239.41.104/search?q=cache:Lurb_nMoW6YJ: www.siliconstrategies.com/story/OEG20030227S0068+i mmersion+lithography&hl=en&lr=lang_en&ie=UTF-8
http://www.future-fab.com/document.asp?d_id=1896
Btw, the last article is written by Dr Bruce Smith (the man who's been working on this). It goes into a lot of coverage of the new methods of microlithography....
The most important part of this process, which no one seems to understand, is not that chips can get smaller.. But that chips can get smaller using the CURRENT TECHNOLOGIES. You don't have to move on to new lasers, but you can use the ucrrent 193nm and 157nm lithography and achieve much better resolutions. The process is still VERY hard to achieve at high yield, but that will change with more research.
RIT isn't touting some great leap in processor performance, but a big leap in the way things are done using lithography in the industry.
Actually, it uses pretty much the same machiens that conventional lithography does.. It just incorporates a new part to the entire tool.. I'll post some better links after i'm finished responding to a few of these comments... Clean rooms will never go away.. You are working with such incredibly small sizes that the smallest number of particles in the air or on your machines will destroy all your work.
Actually, it is MUCH harder to get it right using immersion lithography... It is one of the biggest issues Dr Smith and his affiliates are workign with right now.. Bubbles and other artifacts in the water will cause the wafer to be useless.
The problem with using other materials is that they must be transparent not to light (what we can see) but to UV and other radiation.. If it's not, you might as well be putting lead between the wafer and the mask.