One reason why the industry moved to Cu interconnects as compared to Al is due to lower electromigration. Due to the specific microstructure in Cu and also due to its low bulk diffusion it is much more resistant to Electromigration. Having said that as the nodes start shrinking this might become a problem in the future........ May not be at the 45 nm node though.
Seems like people dont RTFA. Let me Quote "Will we see eight cores in the client in the next two years? If someone chooses to do that, engineering-wise that is possible. But I doubt this is something the market needs."
He is talking about next two years not ever. We just have an abundance of dual core machines in the market now and the apps to take advantage of it. Tell me how much different software we had two years ago than today. If so there is no way a desktop market needs 8 cores two years from now.
Geez we have so many fanbois and script kiddies here with absolutely no knowledge of the industry, it is sickening.
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One reason why the industry moved to Cu interconnects as compared to Al is due to lower electromigration. Due to the specific microstructure in Cu and also due to its low bulk diffusion it is much more resistant to Electromigration. Having said that as the nodes start shrinking this might become a problem in the future........ May not be at the 45 nm node though.
Seems like people dont RTFA. Let me Quote "Will we see eight cores in the client in the next two years? If someone chooses to do that, engineering-wise that is possible. But I doubt this is something the market needs." He is talking about next two years not ever. We just have an abundance of dual core machines in the market now and the apps to take advantage of it. Tell me how much different software we had two years ago than today. If so there is no way a desktop market needs 8 cores two years from now. Geez we have so many fanbois and script kiddies here with absolutely no knowledge of the industry, it is sickening.