Intel Promises A Cool Billion (Transistors)

NevDull writes: "CNN is reporting that Intel has announced new semiconductor packaging which will lead to CPUs with a billion transistors running at 20GHz within 6 years. Yummy!" The advance here is removing the balls of solder between the chip's packaging and the microprocessor core, which leaves room for more transistors (or a thinner package). Like it says, though, this is years away from your pocket Cray.

Comments

More info on this - links & pictures

[morcheeba]

Intel has more info on this (both pdf's):

This backgrounder (4 pages, 17kb) has a basic diagram showing the change.
This briefing (18 pages, 2466kb) is a presentation, but actually has some nice detail. It has some photographs of the devices, better diagrams, and a picture of a naked man in the shower (really!).

I'll summerize:
PGA packaging (as used in many big processors) is basically a ceramic or fiberglass carrier board with pins on one side, wires in the middle (like a small PC board), and some method to directly attach to the chip. The chip is usually connected to the board with small solder balls, like BGAs, but on a smaller scale. The balls provide some flexibility and loose tolerances, but since they are bigger than the wires they connect they require a fairly large pad on the chip. This technology is a way eliminate these balls, allowing for smaller pads, freeing up more area on the die.

But you should check out the pictures -- they describe it better than I do.