New Semiconductor Coolers
An anonymous reader writes: "A new thermoelectric material is 2.4X as efficient as
best existing materials. The new solid state heat pumps
can provide 700 watts of cooling (nearly one horsepower)
with just one square centimeter. These new materials have the
potential to replace current heat sinks, thermoelectric
generators and mechanical heat pumps.
You can also read an article in nature."
This would be great for those of us with 1.4GHz Athlons rumbling away in the corner.
I expect that it will start of as some kind of heat spreader material on CPUs themselves, and possibly in the base plate of the heatsink. It is probably very expensive.
Itanium will need a tonne of the stuff... :)
While this is neat and all, I should hope that more effort goes into lower power consumption in general. Just because there's a better way to cool high-power chips doesn't mean that such a chips are a good idea in the first place.
Someone I know who works in embedded systems recently pointed out that most CPU makers have decided to chase performance at all cost without regard to power consumption, and this is leaving embedded systems engineers up a creek.
The body of this news item is misleading. This material can GENERATE 700 watts of electricity from only one square cm. (specifically under a 58 degree F tempature gradient).
It can also heat and cool things 2.5x more efficiently (then anything else on the market) if you push electrons through it, rather than let them come out.
Very interesting stuff, IMHO. Generating electricity from waste heat with inexpensive materials is a holy grail of sorts in a LOT of applications.
BTW, this is what the patent system was SUPPOSED to protect. True innovation.
http://kered.org
"...can provide 700 watts of cooling (nearly one horsepower) with just one square centimeter..."
Can someone explain exactly what this means? I haven't reach thermodynamics in my physics studies yet.
I mean, I understand "700 watts"--that's 700 Joules/second. So presumably a cm^2 of this material can "cool" 700 Joules of heat energy every second. But surely the limiting factor here is how quickly the *air* (or other surrounding medium) can *accept* energy, not how fast the device can pump it out....right?
I saw this same article over at bottomquark except they had a new release linked as well. The release claimed that just a few dots of this material on a chip would replace (plus some!) a regular heat sink. How on earth could that be? What about the areas where dots aren't located?
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