Next-Generation Chip Fabs

PaulBu writes "As reported in EE Times, a new IBM $2.5B fab will be the first one to 'produce chips using all three of the sophisticated technologies on the industry's bleeding edge: low-k dielectrics, copper interconnect and silicon-on-insulator based transistors' on 300mm wafers. And it runs entirely on Linux! Quote from the article: 'The state of automation in Building 323 is such that 20,000 sensors are used to track wafer lots in front-opening unified pods that are transported from one tool to the next on rails using linear induction motors. The setup resembles an intricate monorail system tuned to millimeter-precision specs. A central control system monitors all stations and tracks wafer lots via 802.11 wireless communications.'"

Comments

Re:What sort of chips?

[entrox]

According to rumours, IBM will unveil a PPC-based desktop processor - something like a Power4 Lite - on October 15th. Some people speculate that Apple will ditch Motorola in favour of IBM and get the new breed of processors from them, since Motorola is lagging behind and doesn't seem to like having Apple as customer (apparently they got burnt when Jobs killed the clone market).

So perhaps they will fab the next-generation (G5?) processor for Apple there. I at least hope so :)

Re:Only mm?

[apirkle]

A technician would pick the basket up off the rail and then use vacuum wands to move the wafers into the loading mechanism for the machine. Once processing was done, vacuum wand the wafers back into the basket and place it back on the track.

You must have been in one of the older fabs. There are two industry standard automated wafer carrier pods used these days: SMIF and FOUP. SMIF (Standard Mechanical InterFace) is used for 200mm wafers, and FOUP (Front Opening Unified Pod) is used for 300mm wafers. The pods are sealed from their environment and are not opened by fab technicians under normal circumstances. The overhead tracks run directly to each machine in the fab, and each fab tool loads the wafers directly from the pod without human intervention.

A major benefit of all this is that the wafers never enter the cleanroom air - they only encounter the air in the pod, and the air in whatever tools they enter. As a result, the air in the cleanroom doesn't have to meet such a high spec, which leads to big savings on air scrubbers.

Accidentilly forget which wafers have been processed already (many of the machines could only load 5 or 10 wafers, and a lot was 24 wafers)? Bad things happen when you double-dope or double-etch wafers.

This is the reason behind the wireless control system. Old fabs use paper-based flow logging, meaning that each wafer lot has a paper attached to show where it has been and where it has to go. Did I mention that this is special (read: expensive) cleanroom paper, because regular paper flakes off lots of particles that are a no-no in the cleanroom environment? In modern fabs, the SMIF and FOUP pods have electronic tags that carry all the information needed to process the wafer lot - the recipe for which machines it has to go to, what to do when it gets to the machine, notes by technicians, etc etc.