Next-Generation Chip Fabs

PaulBu writes "As reported in EE Times, a new IBM $2.5B fab will be the first one to 'produce chips using all three of the sophisticated technologies on the industry's bleeding edge: low-k dielectrics, copper interconnect and silicon-on-insulator based transistors' on 300mm wafers. And it runs entirely on Linux! Quote from the article: 'The state of automation in Building 323 is such that 20,000 sensors are used to track wafer lots in front-opening unified pods that are transported from one tool to the next on rails using linear induction motors. The setup resembles an intricate monorail system tuned to millimeter-precision specs. A central control system monitors all stations and tracks wafer lots via 802.11 wireless communications.'"