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Sony & Toshiba Disclose Cell Fab Plans

Posted by timothy on from the bit-factories dept.

sean23007 writes "InfoWorld is running an article about Sony and Toshiba's plans for new fabrication plants to build the 'Cell' chip jointly developed by Sony, Toshiba, and IBM for use in the Playstation 3 and other home entertainment uses. The new fabs will be located in Nagasaki and Oita, and both companies plan to spend $1.7 billion over the next 3-4 years in their construction. They will be capable of using 300 mm wafers with a 65 nm process. The chip is slated to be the first 1 teraflop consumer device."

5 of 138 comments (clear)

  1. not for Playstation 3 by Anonymous Coward · · Score: 1, Informative

    Another article elsewhere already reported that this chip would not be available in time for use in the Playstation 3. - NCDave

  2. But the Cel isn't going to be in the PS/3 by BancBoy · · Score: 5, Informative

    According to IGN anyhow... To quote - Online news sites are reporting that the spring 2003 issue of Electronic Design Chain, an electronics trade magazine, features PlayStation creator Ken Kutaragi on the cover, and also contains very surprising news about the Playstation 3. According to the reports, Kutaragi mentions that final production of the "Cell" chip, originally thought to be used in the PlayStation 3, may not be ready until 2007. He also confirms that the CPU in the PlayStation 3 will in fact not be the Cell processor, contrary to earlier reports. With a targeted PlayStation 3 launch in 2005/2006, delayed production of the Cell processor may have caused Sony to find a different solution for their next-generation console.

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    [UID-HeinzIntel]
  3. Too bad... by rkischuk · · Score: 2, Informative

    ...the "cell" chip won't be in the PS3.

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    Seen any BadMarketing lately?
  4. Hmmm... by UndercoverBrotha · · Score: 0, Informative

    It won't be called the PS3 anyway, Sony will name it something else.....

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    Solid!
  5. more detailed story.. by Anonymous Coward · · Score: 3, Informative


    http://www.designchain.com/coverstory.asp?issue= sp ring03