AMD Breaks Ground on New Chip Facility
philthedrill writes "AMD announced that they have broken ground on Fab 36, which again will be located in Dresden, Germany. The 300 mm fab is expected to start volume production in 2006. There's more information at CBS MarketWatch." AMD will be moving from its current 200 mm wafer process, and looking to save money through the higher efficiency of the new process, as well as keep up with expected demand for their next generation processors. The MarketWatch article also contains some speculation about probable partners for AMD.
Wouldn't it be cheaper for them to put facilities that mass produce chips in countries where labor is cheap? Most Intel chips I've seen are marked "Made in Malaysia" or "Made in the Philippines."
The feature size is independant of the fab tooling. AMD will implement the smallest affordable feature size at the time the fab comes on line and most likely will be running two feature sizes. Depending on who is making their chips in two years (probably IBM) they will most likely use the same masks and try to get matching silicon up to production levels.
The fab is mostly just the facility (shake proof bldg, class 1, 10, 100, etc, wafer handling). What goes into the fab is the latest equiptment. That equipment will support multiple generations of lithography.
Nobody opposes freedom for Iraqis. Some people, however, think that maybe we should have kept on with the diplomacy a bit longer before sending in troops. Who is right? I don't know. At the very least, it's fairly expensive international-relations suicide to go invading stuff on your own without the help of the UN. But suggesting that because they do not advocate war, Germany opposes freedom for Iraqis is ridiculous.
See my earlier post. US companies are not for the most part moving FABs to Asia. Mostly packaging and final test. I go through the reasons for it, but it basically boils down to packaged processors are about 10x as bulky as the die on a wafer. Therefore, it takes about 10x the labor just to move them to and from the package line or test equipment.