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IC Failures Linked to Resin Series?
MEW writes "According to this article, 'the semiconductor industry began using red phosphorus as a flame retardant instead of the Br-based compound it had used for years,' due to environmental concerns. By July 2002, 1000 tons of the stuff was used for about a billion chips, when they stopped due to high component failures. In particular Sumitomo Bakelite caused rampant failures in Fujitsu disk drives. There's still a lot of Sumitomo Bakelite out there, and we may see the worst of it soon, as components start to fail prematurely. This was posted by Spaceman on Macintouch who says that the bad material accounts for 'half the world's supply of 'IC Plastics'' and can result in 'sudden or premature end of life.'"
first the leaky capacitors, now this. any way to find out exactly what this material went into? like a list of manufacturers using it? i bet not right! btw this was published in December 2002.
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Broken Window Fallacy
Read it, learn it, love it, spread it.
The foam on the last space shuttle was used because it was more environmentally friendly, even though it was inferior. At least that's what I read (just put 'space shuttle foam environment' into google).
I expect you read this article in Capitalist Magazine. The title of the article, "Earth Worshippers Cause Death in Space", really brings home the high levels of dispassionate reporting and journalistic integrity enjoyed by the magazine. Truly, everything they say must be true.
Tubal-Cain smokes the white owl.
no, no. Of course white phosphorous is even more reactive and may even ignite itself when in contact with oxygen. But red phsphorous burns pretty good, too. makes a lot of smoke as well (good for smoke bombs, the smoke forms phosphoric acid thogether with the air humidity though) and together with potassium chlorate (KCl03) it makes nice explosions.
here is a link to a chemicals supplier. notice the risk statements: R11 = Highly flammable, R16 = Explosive when mixed with oxidizing substances
the most sexp i get is my paren-mode.
Red phosphorus is mixed with the packaging resin, which encases chip die and lead frame. It's about 2-3% of that black plastic.
Apparently red phospherus enables an internal short, probably by reacting with the resin to make a carbon channel. This is my best guess, given the info we have.
The majority of US chip companies these days are just design labs. They hire Asian chip foundries to actually render their designs to product, and it appears that they are the manufacturer. More and more the large chipmakers are doing this too -- farming out production. This new process would be used on commodity chips first, like logic and memory. Unlikely to be in high-end chips like processors, A/D, etc.
Some here deride the environmental reasoning for the change. It's pretty stupid to not care about dioxin, no matter where it is. These Exxon fascists would also say that global warming is a myth, because it's cold today... well it's warmer than it was 20 years ago. In about 30 years, you'll be paying for dikes to protect New York and Los Angeles from being flooded, ignorant bastard. Weather will be erratic and catastrophic. But that's not your problem today, now is it? Anti-environmental/anti-intellectual clods should be the ones who suffer for their short-sighted ignorant views, not the world as a whole. But unfortunately that's not how things work.
Campaign finance reform is national security.