Motherboard Design Process
MBRFan writes "MBReview has posted the latest revision of their 'Motherboards - The Designing Process' article. This article covers the design process for modern motherboards, and also goes over some of the most common components that can be found. Definite read for information lovers, though beware, it'll take a while to read!"
I used to design motherboard power system components, and the author spends a good bit of time talking about that. That is actually the most complicated part of the board design, as it is not at all automated. Most component vendors try to sell a complete solution to the motherboard vendor, easing their job somewhat while helping the sales of the component vendor.
One particularly interesting item of note: all those capacitors the author describes are absolutely crucial, and together form one of the largest cost items on the board. The system is tested using a processor-vendor-supplied "load tool" which simulates the worst case load transients one can ever expect to see. Most of that testing is done by the power system component vendor and then provided as a block to the motherboard vendor. Most motherboard vendors have no idea what they are doing there.
In fact, a lot of the foreign manufacturers (no names) cost-reduce their designs by simply pulling out caps until the system blue screens. Then they put the last one back in and sell it. Intel is the only manufacturer I am aware of that actually sells the worst-case performing design.
Note that I am only aware of products related to Intel-type motherboards. I never worked on the othe stuff.
Just my $0.55 (US inflation, 1774-2008, for $0.02)
I've heard stories of crappy motherboards blowing capacitors. Which is why its always better to get the 150 dollar one than the 30 dollar one. Because the 30 dollar one is effectively made out of scrap metal...
PC motheboards aren't terribly complicated as far as PWBs go. The don't really have a lot of components, and they don't have a lot of layers.
What is interesting about them, but I don't think it really complicates the manufacturing proces, is the effort that goes into reducing the number of layers (number of layers is directly related to cost). This compilcates both routing and signal integrity.
(S(SKK)(SKK))(S(SKK)(SKK))
How does crap like this get modded insightful? There are many factors involved in a production process such as motherboards. In many cases trade offs will have to be made between engineering, manufacturing and cost. If the AC who feels maufacturers are not doing the job properly may I suggest he/she/it puts forward a better design than can be mass produced and afforded by the general population
Do not try to read the dupe, thats impossible. Instead, only try to realize the truth
What truth?
There is no dupe
IANAMBD, but...
... I.e the thickness of the "Prepeg"
"trace" == Metal tracks carrying the current
"Prepreg" == insulating "silk" layer separating the metal tracks running above and below.
"static impedance" == "guess" they mean parasitic capacitances formed between the tracks crossing over each other, separated by the "Prepeg".
"Er, or dielectric constant" == See physics book for parallel plate capacitor, the 'E' is the "greek epsilon"
"height of the trace" == the plate separation
.
The guy who wrote this article has a glittering career in the Patent business.
To save the other metric readers the trouble googling, 1 mils = 1/1000 inch = 2.54e-5 metre. conversion