World's First Ultra-Thin Multilayer Circuit Board

neutron_p writes "Seiko Epson has developed the world's first 20-layer circuit board. Multilayer circuit boards are normally produced by using a photolithography. However, the industry has struggled to produce thin, lightweight, high-density multilayer circuit boards. Seiko Epson uses an inkjet-based manufacturing process, which has many advantages over a traditional photolithography process."

Comments

Oh boy,

[kazoosandinstruments]

I don't know how I'm going to keep from breaking one of these things every time I touch it. I have broken some thicker-than-ultra-thin PCBs in my day and don't imagine these to be any less susceptible to the pressure of my indelicate hands. I wonder if/hope we'll see some connectors/slots in the future that don't require a board-breaking effort to slip the peripheral cards out.

This won't replace conventional PCBs

[Avian visitor]

I don't believe this technology will replace the conventional multilayer printed circuit board for some time. At least in mass produced consumer electronics. Perhaps some niche market where there is a requirement that each circuit board is different.

The main advantage of this new technology is that it is relatively cheaper to produce a small quantity of boards because there is no high cost of making masks. Most of the money today is made with consumer electronics where there is a requirement of large series of identical boards so this is no longer such an advantage (the starting cost of mask is almost zero after 1000 or so boards).

The article also does not mention how this type of circuit board is compatible with electronic components. I guess you can not solder SMDs to a trace that is composed of tiny silver particles. This probably means that a totaly new technology for mounting electronic components needs to be developed. The classical soldered spot is one of the most reliable components in electronics and I don't believe any new technology will surpass that anytime soon (this is not so unimportant, considering that an average circuit can have 100s or 1000s of soldered spots).

Printed boards

[keithdowsett]

I can see a couple of limitations which aren't discussed in the article.

Firstly, thin layers of silver particles mean very limited power supplies. The thin layers of insulation will also limit the working voltage. This can be overcome so some extent by printing multiple layers, but that may cause problems in the drying/curing process.

Secondly, the thin layer of insulation will result in significantly higher capacitance between layers. This will probably limit high frequency applications and result in every other layer being a ground plane to limit coupling in other applications.

Still, it's a step in the right direction.

Keith.

dont you understand????

[diablomonic]

no one seems to be picking up on the implications of INKJET PRINTABLE ELECTRONICS :: Open Source Hardware!!!!! download a design for a gadget off 'hardforge', print it out, and away you go. Dont like a design feature on the latest open ipod clone: change it yourself and print a personal custom model.