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The Not-So-Cool Future

markmcb writes "Researchers at Purdue University and several other universities are looking to start work on a major problem standing in the way of future chip design: heat. The team is proposing a new center to consolidate efforts in finding solutions for the problem that is expected to become a reality within the next 15 years as future chips are expected to produce around 10 times as much heat as today's chips. The new center would work to develop circuits that consume less electricity and couple them with micro cooling devices."

3 of 155 comments (clear)

  1. Not Cooling by LordoftheFrings · · Score: 5, Interesting

    I think that the solution to the heat problem will not come with better and more powerful cooling solutions, but rather radically changing how chips are designed and manufactured. The article doesn't contradict this, but I just want to emphasize that. Having some liquid nitrogen cooling unit is not the optimal, or even a good solution.

  2. heat has already been MOBO issue by KarmaOverDogma · · Score: 4, Interesting

    Especially for those of us with newer motherboards who want a completely silent system with as few fans as possible

    First it was CPUs with cooling and big/slow/no fans and big heatsinks, then PSUs GPUs and now MOBOs. My current custom box (now 14 months old) was built to be silent and I had a hard time settling on a motherboard that was state of the art, stable, and still used a passive heatsink to cool the board chipset fan-free. I finally settled on an Asus P4P800.

    I can definately believe heat becoming even more of an issue. For those of us who want power/performance and quiet at the same time, this will become even more of a challenge as time goes on. I for one hope not to rely on expensive and/or complicated cooling devices, like peltier units, water pumps and the like. I hope the focus is on efficient chips that only clock up/power up as they need to, like the pentuim M.

    my 2 cents.

    --
    uR iGn0ranc3, Their Power
  3. Re:Nothing new by lrichardson · · Score: 4, Interesting

    A few years back, I read a couple of articles about reversible chips ... run the op through one way, store the results, then run the exact mirror back through. Net heat result was (theoretically) zero. Reality was about 1-2% of regular heat build-up. But I haven't heard anything more on this. Sure, it effectively halves chip speed. And, even at the time, I thought it would be insane to engineer with the pre-emptive tasking coming into vogue. But something that drops heat production by two orders of magnitude seemed worthwhile pursuing. Anyone else heard where this research is at?