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3-D Flexible Computer Chips

Posted by ryuzaki0 on from the new-lego-on-the-block dept.

Roland Piquepaille writes "Engineers at the University of Wisconsin-Madison have isolated a single-crystal film of semiconductor from the substrate on which it is built. Then they transferred this very thin film — 200 nanometers thick — on plastic. Both sides of the film can host active components and several layers can be stacked, opening the way to very powerful 3-D flexible computer chips. Besides computer chips, this technique could be used for solar cells, smart cards, RFID tags or active-matrix flat panel displays."

1 of 85 comments (clear)

  1. Excellent application for cpu construction. by plasmacutter · · Score: 5, Insightful

    Heat dissipation is a major issue in cpus.. imagine if you could integrate your cpu within the heatsink's mesh at a monocrystaline level.

    It would be a revolution in cooling efficiency.

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