AMD Announces Quad Core Tape-Out
Gr8Apes writes "The DailyTech has a snippet wherein AMD announced that quad core Opterons are taped out and will be socket compatible with the current DDR2 Opterons. In fact, all AM3 chips will be socket compatible with AM2 motherboards. For a little historical perspective, AMD's dual-core Opteron was taped out in June 2004, and then officially introduced in late April, 2005.' AMD also claims that the new quad processors will be demo'd this year. Perhaps Core 2 will have a very short reign at the top?" From the article: "The company's press release claims 'AMD plans to deliver to customers in mid-2007 native Quad-Core AMD Opteron processors that incorporate four processor cores on a single die of silicon.'"
Per TFA, "completion of the design". I was also confused by this phrase in the summary.
Ben Hocking
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Its sort of going gold, with the exception that the latency is MUCH longer.
So even if a perfect, working design tapes out, it will take at least 3months until happy little chips come out at the other end of the factory. Of course, failures, bad yields or bugs that only manifest themself in the physical design can delay this further.
HI O WISE PRINCE. WHT TOOK U SO DAM LONG?
In a word, no.
;)
In brief, AMD is putting together 4 cores on a single die, like their current dual core design. Intel just got to the 2 cores per die stage. Their 4 core design is 2 dual cores slapped together.
This story is about the fact that the next gen of AMD's chips are design complete. More importantly, AMD claims it is going to have a working prototype this year. The importance of this is that if AMD succeeds, they will be able to display a working copy of their next generation CPU when Intel intends to ship their first quads. It could do untold damage to Intel's ability to sell those quads if AMD's quad solution blows it away, as I strongly suspect it will. So does IBM, HP, Sun, and Dell, as all have signed on for AMD to power their servers.
This puts the shoe firmly back on Intel's foot. I'm sure Intel was hoping to not wear it for at least a little while.
The cesspool just got a check and balance.
I don't think that magnetic tape was involved in the original process at all. As Chris Burke said, the masks were layed out with colered tape on a drafting table. When they were completed they were photographicaly reduced to the size needed to be transfered to silicon for etching. My father used to design printed circuit boards the same way.
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Having designed a couple consumer devices where we had to burn silicon, I can say the grandparent post is the correct one. "Taping Out" is a referance to the stamp having been successfully created. This used to be accomplished by using lenghts of electrical tape on sheets of glass, but the templates I have taped-out (and I assume the rest of modern templates) are done by silk-screening the pathways directly onto high-temp plexiglass.
Erutangis ym si siht.
I think the phrase referred to in times past, when the design for a chip was literally made into masks for the photo-etching process by taping patterns onto plates.
Now you'd probably have to go to a museum to actually see this being done (or to somebody who was doing it as a hobby or project, which is where I've seen it), but the language has stuck.
When a design has been "taped out," it's basically ready for production; it's ready to be actually etched into the silicon and for the manufacturing process to begin.
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