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Intel 45nm Fab Process Launched And Penryn Preview

NinjaKicks writes "Intel has decided to make public details of their new 45nm manufacturing process and also has broken news that next-gen Penryn core processors are running various versions of Windows and Vista successfully. Penryn will offer a host of core tweaks over Conroe, larger cache sizes, and SSE4 support. Also, although clock speeds will be increased, processors based on Penryn should fall within the same thermal power range as Conroe. Word is Penryn will also be compatible with some of the existing motherboards on the market while others will need either a BIOS update or perhaps other board-level changes."

6 of 113 comments (clear)

  1. Is this a major breakthrough? by kestasjk · · Score: 4, Interesting
    • ~2x improvement in transistor density, for either smaller chip size or increased transistor count
    • ~30% reduction in transistor switching power
    • >20%improvement in transistor switching speed or >5x reduction in source-drain leakage power
    • >10x reduction in gate oxide leakage power

    As a layman this sounds like a pretty massive improvement. Is this a major breakthrough or is this progress as usual?
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    1. Re:Is this a major breakthrough? by Bender_ · · Score: 4, Interesting

      This is the first time since 1969 that a major modification to the MOSFET gate stack occured. In fact it is fairly major. I should remind you that this is a structure that is replicated around 1e19 times each year and is responsible for the biggest part of the 270 Billion US$ semiconductor market.

      At least ten years of work in academia and industry and billions of dollars were poured into this. Intel is the first company to make the move and introduce high-k.

      (Yes, there were a few minor modifications to the SiO2/Poly stack in between: Plasma nitridation and numerous improvements on SiO2 growth)

  2. FTFA by Aaron+England · · Score: 4, Interesting
    This is a show of strength if you will, and an impressive one at that. How impressive? We'll wrap-up here with a few quotes from Gordon Moore (Intel), Professor Dimitri Antoniadis (MIT), and Yoshio Nishi (Stanford) telling you what they think of Intel's achievements.

    "The implementation of high-k and metal gate materials marks the biggest change in transistor technology since the introduction of polysilicongate MOS transistors in the late 1960s" - Gordon Moore

    "The Intel 45-nm CMOS technology marks a historic milestone for the semiconductor industry. Similar to the transition from single metal (Al) gate to polysilicon gate that has allowed optimal nFET and pFET design, the introduction of dual metal with high-k-insulator gate-stack opens the path for optimal design of both types of FETs, at insulator thicknesses necessary for continuing device scaling that are impossible to reach with the industry-standard silicon-dioxide-based insulators. Many options of high-k gate-stacks have been the target of intense industry and academic research for many years now, but Intel's demonstration of a manufacturable dual-metal/high-k solution is a remarkable first." - Prof. Dimitri Antoniadis

    "It is a huge break through to replace more than three decade's long successful polysilicon gate technology with a new high-k+metal gate technology. Though the combination of high-k dielectrics and metal gate electrode for advanced CMOS has been extensively studied by many researchers around the world as the ideal MOS gate structure, the technical hurdle to bring the technology to manufacturing floor has been believed still too high for the 45nm node. As a researcher in this field, I am pleasantly surprised by the announcement and would like to congratulate Intel researchers for their success that Intel has demonstrated 45nm microprocessors with their high-k and metal gate technology. Even though specific metal and high-k material have not been disclosed at this moment, this is a revolutionary step toward the world of sub-50nm CMOS integrated circuits, as this new technology will drastically improve transistor performance in all fronts of electrical specifications, resulting in significant improvement of IC performance." - Yoshio Nishi

  3. Re:Still on the FSB by antifoidulus · · Score: 5, Funny

    2 duel-cores

    Spelling Nazi time: It's dual! Dual! It's only "duel" if your processors are firing pistols at each other from 10 paces at dawn!

  4. I have been convinced... by Belial6 · · Score: 5, Insightful

    I have been convinced for a long time that software bloat is not a problem. You touch on the reason. For the last decade, it has been cheaper to throw more hardware at a problem than it has been to optimize code. At some point in time, there will likely be a stall in speeding up hardware. When that happens we have a many years of continuing our computer speed ups via software optimizations. Heck, I know that I write inefficient code all the time. It is a simple cost/benefit choice. My clients do not want to pay tens of thousands of dollars to solve a problem that can be solved with $1000 worth of hardware. It's not that I couldn't optimize my code, and it's not that I wouldn't love to optimize my code. It's just the most companies don't want to pay for it.

  5. Error in TFA by dreddnott · · Score: 4, Interesting

    The article linked above refers to "Halfnium", with is both an element that does not exist and a gross misspelling of Hafnium , which is the new High-K replacement for silicon dioxide. It's also worth pointing out that both IBM and Intel announced this breakthough almost simultaneously, and AMD will reap the windfall benefits through its own partnership with IBM (they will move to the 0.45 process some time in 2008). AMD has also announced a low-K breakthrough that they will be implementing in their 0.65 process as well.

    To give Intel sole credit for this breakthrough might be a little inaccurate.

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