IBM Doubles CPU Cooling With Simple Change

Ars Technica is reporting that IBM has discovered a new cooling breakthrough that, unlike several other recent announcements, should be relatively easy and cost-effective to implement. "IBM's find addresses how thermal paste is typically spread between the face of a chip and the heat spreader that sits directly over the core. Overclockers already know how crucial it is to apply thermal paste the right way: too much, and it causes heat buildup. Too little, and it causes heat buildup. It has to be "just right," which is why IBM looked to find the best way to get the gooey stuff where it needs to be and in the right amount, and to make it significantly more efficient in the process."

Comments

this seems like a good idea..but.

[atarione]

for something like a CPU which (if you are a big enough nerd) gets taken out swapped..etc occasionally.. how much harder would it be to get the old paste off... in order to have fresh new (effective) paste on when reinstalling the CPU???

for the record after years of overclockers lapping their cpu's to a mirror surface i am amused that IBM now says the rough surface is more effective =p

Re:Excellent

[gweihir]

sure, it does. Less fans = less power consumption.

This effect is not of any significance....