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AMD Multi-Core G3MX DRAM Interface Details Emerge

MojoKid writes "New details have emerged regarding AMD's upcoming G3MX technology. The 'future Opteron Platform' AMD mentioned in their press release seems to be built around a CPU currently codenamed 'Hydra'. Hydra will still feature an on-die memory controller, but unlike current platforms it will be geared for DDR3 memory. The processor will interface to one or more G3MX chips, which in turn provides the interface to the memory slots. G3MX will act as a memory port extender for the memory controller in the CPU socket and a serial link to the RAM.The electrical signaling between the memory controller and G3MX is based on HyperTransport 3.0."

13 of 43 comments (clear)

  1. DDR3? by Anonymous Coward · · Score: 2, Funny

    I didn't even know there was a DDR2. But then again, I'm not a dancing japanophile idiot.

    1. Re:DDR3? by CajunArson · · Score: 4, Informative

      Don't confuse graphics DDR3 with DDR3 SDRAM used for general system memory. They are completely different beasts.

      --
      AntiFA: An abbreviation for Anti First Amendment.
  2. So a mini north bridge chip? by Brit_in_the_USA · · Score: 4, Insightful

    Looks like a mini northbridge - just memory and no PCIe or AGP or anything else.

    I wonder what the latency hit is going to be with lots of them on a server and moving data from one branch of a tree to another?
    BR> I guess if they don't deviate from HT3 spec too much lots of other applications could emerge for this chip, with the inclusion of partnerships to bring DSP's and other accelerators / CPU alternatives to the server line this is turning more and more into Lego.

  3. Marketing Translation by Anonymous Coward · · Score: 2, Funny

    Translation: "We've taken some moderately new technology and repackaged it with buzz words to make you think you need it."

    1. Re:Marketing Translation by Tribbin · · Score: 2, Funny

      Wow! For a moment I doubted my own intelligence there, trying to get anything specific out of the press release. Then I realized I had read similar sentences on the 'Dilbert Mission Statement Generator'.

      http://www.dilbert.com/comics/dilbert/games/career /bin/ms.cgi

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  4. Re:DDR3? Actually... by Anonymous Coward · · Score: 2, Funny

    weird Japanese game
    There's weird shit coming out of Japan?

    When did that start?
  5. good luck AMD by edxwelch · · Score: 2, Interesting

    It'll be interesting to see if AMD actually get to deliver this technology before they run out of money (http://uk.theinquirer.net/?article=41700)

  6. Re:PowerPoint City! by eniac42 · · Score: 4, Interesting

    Despite the propoganda they are not pure angels and Intel is not pure evil either.

    Maybe so, but thats not the point. I just dont want to see the mainstream PC processor market to become a one-horse race. If AMD had not been there, Intel would probably still be making P4s clocked at 1ghz today.. Having said that, I dont think AMD can take Intel head on - they are right to (or need to) find other niches..

    --
    "A nation that forgets its past is doomed to repeat it." - Churchill
  7. Actually... by Brane2 · · Score: 5, Informative

    this concept seems quite sensible.

    They are using G3MX chips as a sort of multiplexer and connecting it to the CPU though a couple of lanes with high-speed signaling.

    Internal logic within HYDRA CPU will have the capability to use either conventional onboard memory controller and drive the DDR-3 RAM directly or when socketed within board with G3MX extenders, use that same lines for communication through the G3MX.

    Since the load on the lines will be much smaller and constant and since all lines are unidirectional, each line will be capable of much higher signaling speed, so they will be able to use 4x as much RAM as before per CPU node.

    If that is not enough, several Hydra CPUs could be connected through HT links- just like now with existing Opterons.

    CPU-G3MX connection is much more direct and probably need not to use extra cycles for node addressing, unlike conventional internode communications through HT links, so time overhead could be considerably smaller...

    Also, compared to FB-DIMMs, when accessing to some RAM bank here user only pays some throughput penalty (if any), but doesn't suffer much extra latency- with FB-DIMMs data hos between the modules and each hop costs one clock, so access time for 4-th module is longer than to the first one in a group.

    Not to mention that GMX-3 chip could host some L3 cache if needed in some later implementation and that combined speed of all G3MX chips is probably greater than existing solution, so interesting effects could be achieved with meory interlieve.

    It could very well be that such combination could have distinct speed advantage even in many workstation applications...

    1. Re:Actually... by raxx7 · · Score: 3, Interesting

      Intel, IBM et all have been using similar memory extenders on server chipsets for quite some time.
      For example, check the XMBs on Intel's E8500 chipset.

      The reason why Intel has moved from such memory extenders and pushing FB-DIMM is simple though: there won't be a 4th DIMM on G3MX. DDR3 isn't likely to support more than 2 registered DIMMS per channel, 4 rank each.

    2. Re:Actually... by raxx7 · · Score: 3, Insightful

      No, it's not all bad. GM3X is a sensible solution, with a different set of tradeoffs than FB-DIMM.

      In both FB-DIMM and G3MX case you have the basic concept: Memory Controller --- buffer --- DRAM
      The difference is where the buffer is. On G3MX is't on the board and it can handle 1 or 2 DRAM modules. On FB-DIMM it's on the DIMM itself and can only handle one module but buffers can be daisy chained.

      G3MX allows you the flexibility of having up to 2 modules per channel without an extra latency.
      With FB-DIMM, each modules in the channel worsens your average latency. The only way to add more modules without worsening latency is adding more channels. But each channel requires quite a bit of sillicon on the memory controllers, so it's not the best solution in the world.

      OTOH, FB-DIMM allows up to 8 modules per channel. G3MX only allows two.
      The only way to get more modules with G3MX is adding more channels. Not only each channel costs a bit of sillicon as I mentioned earlier (I'm ignoring the fact that it actually costs you an entire CPU), it also costs quite a bit of board area too.
      DDRx channels require a lot more traces and board area than the FB-DIMM or HT links. We'll problably see some servers with the G3MX buffers and memory slots in daugher boards instead of mainboards, which will mititage the board area problem.

      I don't think G3MX chips will have any kind of intelegence. They'll just be "dumb buffers", like FB-DIMM's AMBs or E8500's XMBs.
      All the intelegence will be back at the memory controller, in the CPU die as usual: which pages will be open, what should be prefetched, etc.

  8. "Based On" Hypertransport 3.0? by Courageous · · Score: 2, Interesting

    Something bugs me about the chart in TFA.

    It shows 13 lanes outgoing and 20 lanes incoming to each G3MX unit.

    And then it references hypertransport. However, hypertransport is a duplex standard. It can transfer data 20GB/sec in each direction per 32bit link.

    So how am I to interpret this.

    Anyway, supposing that each of those 3GMX units is anything at all similar to an 32-lane HT3.0 protocol, we're talking 80GB/sec of memory bandwidth per processor. That's just nuckin' futz! :-)

    C//

    1. Re:"Based On" Hypertransport 3.0? by Brane2 · · Score: 2, Insightful

      They have probably meant to say that the same pin drivers will be used as they are on the HT-3.0 links.

      Given that it took a considerable effort to develop such superfast drivers on silicon chip and that it is now in their existing know-how it seems only reasonable to leverage it to the maximum use...