Startup Offers Peltier-On-Chip
LowSNR writes "The South Carolina based startup Nextreme, Inc. is developing technology to put Peltier Coolers in chip packages, according to an Ars Technica report. The tiny coolers could be situated on top of local hotspots on the die and pump heat away through a package pin to the motherboard. Also, the Seebeck Effect allows the waste heat to be used to be harvested to generate/reclaim power."
Both the heat recycling and heat reduction aspects of this start-up's tech work fine and would be extremely useful and practical, were it not for one small problem: The technology requires the entire CPU/GPU's circuit layout to be designed with this technology in mind. I'm betting that more pressing issues will influence the direction of chip development.
"Be light, stinging, insolent and melancholy"
Wow... I just needed to reply to myself to say that I'm truly ashamed to have written that.
No, having an idea is where it all begins. Not doing anything with that idea is what's worth squat. Guilty!
It counts for a lot, provided you have enough to file a patent.
I just read Slashdot for the articles.