IBM Water-Cools 3D Multi-Core Chip Stacks
An anonymous reader writes "Water cooling will enable multi-core processors to be stacked into 3D cubes, according to IBM's Zurich Research Laboratory which is demonstrating three-dimensional chip stacks. By stacking memory chips between processor cores IBM plans to multiply interconnections by 100 times while reducing their feature size tenfold. To cool the stack at a rate of 180 watts per layer, water flows down 50-micron channels between the stacked chips. Earlier this year, the same group described a copper-plate water cooling method for IBM's Hydro-Cluster supercomputer. The Zurich team predicts high-end IBM multicore computers will migrate from the copper-plate water-cooling-method to the 3-D chip-stack in five to 10 years." Reader Lilith's Heart-shape adds a link to the BBC's article on these internally-cooled chips.
Water cooling is great for the bleeding edge enthusiast, but it's hardly an option for the workaday computer users. Laptops certainly could stand to use some better heat dissipation, and if water cooling through 50nm tubes is possible here, how long until it is both cost effective and size-effective for people who aren't interested in hardware for its own sake to see this type of thing offered to us, the average computer user?
And is stacking the chips better than laying them flat and in a strip (like Pentium M)?
IBM and water cooling of chips is not really new. I remember reading of some research they did back in the 80's when they etched micro channels on the back of processor chips, and forced water through them. IIRC, they reckoned they could eventually dissipate almost 1KW per square centimeter.
You want to drive bipolar chips fast, you apply more power. And end up with a piece of silicon dissipating way more heat per unit area than an electric fire. Mind you, so do Athlons.
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What about FREEEZING???? you limit chip to an environment where water is liquid - also size of molecules is finite and chips sizes decrease, water will not... I guess a PLATE or MANIFOLD would work and simplify connectivity... this is also SCALABLE into some supercooling/conductivity
...that's the beauty of time travel...bye
What i don't get is why not use helium since it can cool to such low temperatures and knowing these chips are going to get super hot. It seems to me you would want to drop the temps more than water cooling would to keep performance high. And it isn't like money is an object for these systems,after all we are talking "big iron" after all. But that is my 02c,YMMV
ACs don't waste your time replying, your posts are never seen by me.