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Tin Whiskers — Fact Or Fiction?
bLanark writes "Some time ago, most electronics were soldered with old-fashioned lead solder, which has been tried and tested for decades. In 2006, the EU banned lead in solder, and so most manufacturers switched to a lead-free solder. Most made the switch in advance, I guess due to shelf-life of products and ironing out problems working with the new material. Lead is added to solder as it melts at low temperature, but also, it prevents the solder from growing 'whiskers' — crystalline limbs of metal. The effect of whiskers on soldered equipment would include random short-circuits and strange RF-effects. Whiskers can grow fairly quickly and become quite long. Robert Cringley wrote this up this some time ago, but it seems that the world has not been taking notice. I guess cars (probably around 30 processors in a modern car) and almost every appliance would be liable to fail sooner than expected due to tin whiskers. Note that accelerated life-expectancy tests can't simulate the passing of time for whiskers to grow. I've googled, and there is plenty of research into the effects of tin whiskers. I should point out that the Wikipedia page linked to above states that tin whisker problems 'are negligible in modern alloys,' but can we trust Wikipedia? So: was the tin whisker problem overhyped, was it an initial problem that has been solved in the few years since lead-free solder came into use, or is it affecting anyone already?"
SnAgCu Rohs solder(with 3% silver and .05% copper) joints don't appear to whisker but they appear dimpled and shitty compared to the smooth, shiny joints of garden-variety tin/lead. At least in the electronics industry, your percenteges and mileage may vary.
One thing to remember is that safety control and monitoring products like fire alarms, but probably also car electronics, are excepted from the RoHS directive until at least 2012, possibly until 2018, but there's really no fixed date set yet. So yes, your DVD player might die, your car probably won't.
c++;
Well, NASA Goddard are worried about the situation and they have done extensive studies on the subject:
http://nepp.nasa.gov/WHISKER/
Ganty
Tin whiskers are, in fact a reality. They are a problem with pure tin specifically. The older tin-lead, and newer tin-vanadium alloys don't have the problem. However, many manufacturers still manufacture parts in a pure tin variety. The reason for all of this pure tin madness is that the EU passed strict anti-lead regulations and so the lead had to be removed from electronics. EU manufacturers immediately started using pure tin parts. In the US, many manufacturers followed suit, partly because pure tin parts were now more available than tin-lead (and at the time there was hardly any tin-vanadium), and partly because they wanted to maintain a good environmental image. Some manufacturers, having been burned by the whisker problem insisted on a better solution hence the tin-vanadium solders now available. The problem is there are a lot of electronics out there with pure tin parts in there. For example, I'm no fan of flying on Airbus aircraft manufactured in the late '90s and early 2000s (pure tin baby). The thing is, the hardware will work perfectly... until it doesn't, then an errant short will cause a malfunction and in the act, the tin whisker will vaporize. The only way you'll find the problem is with electron microscopy.
Remember also the phenomenon of melting-point depression: when two substances are combined in an alloy (e.g., lead and tin) the melting point of the alloy can be lower than the melting point of either individually.
The Pb-Sn eutectic temperature is around 183 C. That's what the summary is referring to.
...but is the amount of lead in solder really dangerous?
The risk is likely more to people repairing and building electronics than to the consumer. The last transmitter tech that I worked with was adamant about handwashing and always had a high wattage light positioned over solder work so that rising hot air would draw lead fumes up and away from his face.
People who hand load ammunition face a similar long term but real risk of lead exposure.
Three Squirrels
The board was in the field in a T&M application for about 1 year. Root cause pointed to 2 factors. First the board had very poor (actually out of spec) via to pad alignment. The result was significantly increased voltage density between the offending 12V via and the ground plane. The second factor WAS RoHS compliant board prep and solder. Basically drilled and plated via holes are not 100% sealed (rough bits of fiberglass can still protude through the plating). The solder was one of these high Tin (97%) varieties, and we got dendrite growth (not the more common whisker growth) INSIDE the board along the fiberglass fibers between the via hole and the ground plane, creating a short from a ~30A power bus to ground. The board caught fire. Indications are that it creates a crappy short that repeatedly fries open, and regrows causing intermittents, then eventually enough heat for fire if the power supply can handle it. Higher power electronics with dendrite growth or tin whiskers may fail only briefly (or not at all) when a wimpy short occurs. Low power signal lines won't always have enough juice to overcome the short and may fully die on the very first short. Our safety/reliability group said dendrite growth is a known, but poorly talked about issue that is greatly exacerbated by the lack of lead, and greatly increased board densities today. To a previous post about melting points. Yes, Tin/Lead solder melts well below the melting point of either element in the alloy, at about 175-180C depending on the particulars. NASA literature indicates that conformal coating is ineffective against whisker growth. At a previous defense sub-component job we had to resort to getting many parts re-plated with a tin/lead finish over their matte tin finish to comply with contract requirements. Most commercial off the shelf parts (COTS) are no longer available with anything but matte Tin, or other RoHS finishes. Many vendors changed finishes without any notice, creating havoc in our stick room.