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AMD Graphics Chips Could Last 10X To 100X Longer

Posted by kdawson on from the bumping-the-solder dept.

An anonymous reader writes "According to a research report out of UCLA, released this morning, NVidia's high-lead bump packaging could last anywhere from 1/10th to 1/100th as long as AMD's advanced eutectic bump approach. (TG Daily has picked up the claim.) NVidia is currently in the midst of a $200M recall of bad GPUs, and the report suggests that the issue could be much deeper than NVidia's PR department would have us believe." The report lends credence to the strident claims of the Inquirer's Charlie Demerjian, which we discussed a month back.

3 of 150 comments (clear)

  1. More data please! by unix_geek_512 · · Score: 4, Interesting

    What does 1/10th and 1/100th actually mean in standard solar days?

    Can someone please provide a plot of the various solders and their performance vs. temperature and time?

    I would like to see the plots for ====>

    90Pb10Sn
    60Pb40Sn
    97Sn2.5Ag0.5Cu
    99.3Sn0.7Cu
    96Sn4Ag
    99.25Sn0.75Cu

    What is the risk associated with Tin? Especially Tin whiskers.

    What kind of solders does the slashdot community use?

  2. Re:To Quote from 'Count Zero'... by Detritus · · Score: 4, Interesting

    The silicon may not wear out but I've seen pictures from an electron microscope that show that the metal interconnects can deteriorate and fail. See electromigration.

    --
    Mea navis aericumbens anguillis abundat
  3. Re:To Quote from 'Count Zero'... by IorDMUX · · Score: 4, Interesting

    If you're building chips where electromigration is an issue within any half-reasonable time span, you're doing it wrong.

    --
    >> Standing on head makes smile of frown, but rest of face also upside down.