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New Heat-Reduced Magnetic Solder Could Revolutionize Chip Design
A new heat-reduced soldering technique using magnets may lead to some revolutionary changes in the way chips are manufactured. Details are scant since the inventor seems to be playing it close to the vest for now in hopes of attracting chipmaker interest. "The result is a tin-silver alloy that contains a dispersion of iron particles tens of micrometers in diameter. When a magnetic field is applied to the solders, two things happen. First, the iron particles heat up, locally melting the solder. This localized heating, which works on the same principle as inductive stoves, remains completely contained, keeping the surrounding area cool. And second, the iron particles line up with the direction of the magnetic field, squeezing and pushing the liquid in that direction. This alignment is retained when the solder solidifies, and the well-ordered particles provide mechanical reinforcement that's greater than that afforded by a regular dispersion of particles."
Will Microsoft install a magnetic field generator in the next Xbox to ensure the solder fails there, too?
Kwisatz Haderach
Sell the spice to CHOAM
This Mahdi took Shaddam's Throne
How much iron are we talking about? Is this tantalum to having ferrite beads on all connections now?
-jcr
re-engineered that for you.
Will the PCB include a capacitor for this flux?
bomb the us up set someone
(which yes, wouldn't bond to SnAg)
With a chemical formula like that, how can it not bond?
Now that I think about it, I'm pretty sure everything I just said is completely wrong.
If only there was some way to alternate the magnetic field...
But that's crazy Star Trek talk
That's not a diversion, you're cementing the point and expressing solidarity.
Care to try that in haiku?