New Heat-Reduced Magnetic Solder Could Revolutionize Chip Design

A new heat-reduced soldering technique using magnets may lead to some revolutionary changes in the way chips are manufactured. Details are scant since the inventor seems to be playing it close to the vest for now in hopes of attracting chipmaker interest. "The result is a tin-silver alloy that contains a dispersion of iron particles tens of micrometers in diameter. When a magnetic field is applied to the solders, two things happen. First, the iron particles heat up, locally melting the solder. This localized heating, which works on the same principle as inductive stoves, remains completely contained, keeping the surrounding area cool. And second, the iron particles line up with the direction of the magnetic field, squeezing and pushing the liquid in that direction. This alignment is retained when the solder solidifies, and the well-ordered particles provide mechanical reinforcement that's greater than that afforded by a regular dispersion of particles."

Comments

What about the RF characteristics?

[jcr]

How much iron are we talking about? Is this tantamount to having ferrite beads on all connections now?

-jcr

iron, huh?

[metamechanical]

The result is a tin-silver alloy that contains a dispersion of iron particles tens of micrometers in diameter.

Not saying it can't work, as the above is light on precise chemistry, but in an alloy like this, you're bound to have atoms floating around... say, to the surface of the deposition... where it will oxidize. And something like OSP (which yes, wouldn't bond to SnAg) only lasts so long in storage... Don't we already have ENOUGH problems with solder joint oxidation? I look forward to seeing how this issue is addressed.