Slashdot Mirror


New Silicon-Based Memory 5X Denser Than NAND Flash

Lucas123 writes "Researchers at Rice University said today they have been able to create a new non-volatile memory using nanocrystal wires as small as 5 nanometers wide that can make chips five times more dense than the 27 nanometer NAND flash memory being manufactured today. And, the memory is cheap because it uses silicon and not more expensive graphite as been used in previous iterations of the nanowire technology. The nanowires also allow stacking of layers to create 3-D memory, even more dense. 'The fact that they can do this in 3D makes makes it highly scalable. We've got memory that's made out of dirt-cheap material and it works,' a university spokesman said."

35 of 162 comments (clear)

  1. It has been obvious for years. by symbolset · · Score: 3, Interesting

    When we run out of possibilities in shrinking the process we go vertical and take advantage of the third dimension. Moore's law is safe for a good long time.

    This tech is still several years out from production but other 3D silicon options are in testing, and some are in production.

    When the Z density matches the X and Y density in fifteen years or so we'll be ready for optical or quantum tech.

    --
    Help stamp out iliturcy.
    1. Re:It has been obvious for years. by oldspewey · · Score: 3, Funny

      You mean, by changing the contents of the memory over time? Now that's just crazy talk.

      --
      If libertarians are so opposed to effective government, why don't they all move to Somalia?
    2. Re:It has been obvious for years. by LifesABeach · · Score: 3, Funny

      ...5X Denser Than NAND Flash... Flash is sure taking a beating these days, first Apple, now Intel.

    3. Re:It has been obvious for years. by Surt · · Score: 4, Insightful

      We don't just go vertical without solving the heat dissipation problem. We already have a hard time dissipating the heat off the surface area of one layer. Now imagine trying to dissipate the heat off of the layer that is trapped between two more layers also generating the same amount of problematic heat. Then try to figure out how to dissipate the heat off a thousand layers to buy you just 10 more years of Moore's law.

      --
      "Who is the Journal of Quantum Physics going to believe?" --Stephen Hawking
    4. Re:It has been obvious for years. by Anonymous Coward · · Score: 2, Interesting

      Well, at least you have a theoretical possibility to avoid that problem in ssd-disks.
      Since you are only going to access one part of the memory at a time the rest could be unpowered. This gives a constant heat do get rid of regardless of the number of layers.

      This is of course not possible for CPU's and other circuits where all parts are supposed to be active.

    5. Re:It has been obvious for years. by Jeremi · · Score: 3, Interesting

      We don't just go vertical without solving the heat dissipation problem

      The obvious solution to that: don't generate any heat. Now, where are the room-temperature superconductors I was promised???

      --


      I don't care if it's 90,000 hectares. That lake was not my doing.
    6. Re:It has been obvious for years. by evilWurst · · Score: 5, Insightful

      It's not as obvious as it sounds. Some things get easier if you're basically still building a 2D chip but with one extra z layer for shorter routing. It quickly gets difficult if you decide you want your 6-core chip to now be a 6-layer one-core-per-layer chip. Three or four issues come to mind.

      First is heat. Volume (a cubic function) grows faster than surface area (a square function). It's hard enough as it is to manage the hotspots on a 2D chip with a heatsink and fan on its largest side. With a small number of z layers, you would at the very least need to make sure the hotspots don't stack. For a more powerful chip, you'll have more gates, and therefore more heat. You may need to dedicate large regions of the chip for some kind of heat transfer, but this comes at the price of more complicated routing around it. You may need to redesign the entire structure of motherboards and cases to accommodate heatsinks and fans on both large sides of the CPU. Unfortunately, the shortest path between any two points is going to be through the center, but the hottest spot is also going to be the center, and the place that most needs some kind of chunk of metal to dissipate that heat is going to have to go through the center. In other words, nothing is going to scale as nicely as we like.

      Second is delivering power and clock pulses everywhere. This is already a problem in 2D, despite the fact that radius (a linear function) scales slower than area and volume. There's so MUCH hardware on the chip that it's actually easier to have different parts run at different clock speeds and just translate where the parts meet, even though that means we get less speed than we could in an ideal machine. IIRC some of the benefit of the multiple clocking scheme is also to reduce heat generated, too. The more gates you add, the harder it gets to deliver a steady clock to each one, and the whole point of adding layers is so that we can add gates to make more powerful chips. Again, this means nothing will scale as nicely as we like (it already isn't going as nicely as we'd like in 2D). And you need to solve this at the same time as the heat problems.

      Third is an insurmountable law of physics: the speed of light in our CPU and RAM wiring will never exceed the speed of light in vacuum. Since we're already slicing every second into 1-4 billion pieces, the amazing high speed of light ends up meaning that signals only travel a single-digit number of centimeters of wire per clock cycle. Adding z layers in order to add more gates means adding more wire, which is more distance, which means losing cycles just waiting for stuff to propagate through the chip. Oh, and with the added complexity of more layers and more gates, there's a higher number of possible paths through the chip, and they're going to be different lengths, and chip designers will need to juggle it all. Again, this means things won't scale nicely. And it's not the sort of problem that you can solve with longer pipelines - that actually adds more gates and more wiring. And trying to stuff more of the system into the same package as the CPU antagonizes the heat and power issues (while reducing our choices in buying stuff and in upgrading. Also, if the GPU and main memory performance *depend* on being inside the CPU package, replacement parts plugged into sockets on the motherboard are going to have inherent insurmountable disadvantages).

    7. Re:It has been obvious for years. by OeLeWaPpErKe · · Score: 3, Informative

      2D : anything that only has connections in 2 directions. The fact that it's stacked does not change it's 2Dness, if the layers don't interact in a significant way (a book would not be considered 3d, nor even 2.5D, nor would a chip structured like a book).
      2.5D : anything that has connections in 3 directions, but one of the directions is severely limited in what it can connect, and which way the wires can run (e.g. you can only have wires straight up with no further structure)
      3D : true 3D means you can etch any 3d structure at all (meaning e.g. you can implement a transistor at a 30 degree angle from another)

      The most advanced tech in silicon chips we have now is 2.5D, and these chips are still not fully 3D.

    8. Re:It has been obvious for years. by takev · · Score: 2, Interesting

      I think we will have to wait until we have super-semi conductors. One where it either conducts perfectly, or not at all, depending on a third input (which itself has an infinite resistance).

      Maybe I should patend this "idea" for a transistor, I am probably to late though.

    9. Re:It has been obvious for years. by Alef · · Score: 2, Informative

      First is heat. Volume (a cubic function) grows faster than surface area (a square function). It's hard enough as it is to manage the hotspots on a 2D chip with a heatsink and fan on its largest side. With a small number of z layers, you would at the very least need to make sure the hotspots don't stack.

      I'm not saying your point is entirely invalid, however, heat isn't necessarily a problem if you can parallelize the computation. Rather the opposite, in fact. If you decrease clock frequency and voltage, you get a non-linear decrease of power for a linear decrease of processing power. This means two slower cores can produce the same total number of FLOPS as one fast core, while using less power (meaning less heat to dissipate). As an extreme example of where this can get you, consider the human brain -- a massively parallel 3D processing structure. The brain has an estimated processing power of 38*10^15 operations per second (according to this reference), while consuming about 20 W of power (reference). That is several orders of magnitude more operations per watt than current CPU:s have.

  2. Memory crystals by stox · · Score: 4, Funny

    Nope, no one saw that one coming.

    --
    "To those who are overly cautious, everything is impossible. "
  3. Re:Is anybody writing this down? by MichaelSmith · · Score: 3, Insightful

    All we ever see is a drop in the price of USB sticks in the shop, but under the surface the duck is paddling as hard as ever.

  4. Re:Is anybody writing this down? by HBoar · · Score: 2, Insightful

    how many do we ever actually purchase?

    Some. Is that not enough to make it newsworthy?

  5. I wouldn't be so sure by TubeSteak · · Score: 2, Informative

    "Dirt cheap" isn't here to stay.

    Their technology requires polycrystalline silicon & the demand is increasing much faster than the supply.
    China might build more polysilicon factories, but they'll undoubtedly reserve the output for their own uses.
    This isn't a new problem, since mfgs have been complaining about shortages since 2006-ish (IIRC).

    --
    [Fuck Beta]
    o0t!
    1. Re:I wouldn't be so sure by fuzzyfuzzyfungus · · Score: 4, Insightful

      Were we to run out of silicon, it'd be time to find a new rock because something very serious has happened to this one. That said, the fact that silicon is among the most common of atoms tells us nothing about the short to medium term supply of sufficiently pure and correctly structured polycrystaline silicon.

      If it takes 18 months to bring a plant online, that is pretty much the limit of the market's ability to cope with surprise demand(minus any slack in existing capacity that can be wrung out). For highly predictable stuff, no big deal, the plant will be built by the time we need it; but surprises can and do happen, even for common materials(especially given the degree to which "just in time" has come to dominate the supply chain. This isn't your merchant-princes of old, sitting on warehouses piled high. Inventory that isn't flowing like shit through a goose is considered a failure, with the rare exception of "national security" justified stockpiles or the rare hedge or futures position that is actually stored in kind, rather than in electronic accounts somewhere...)

  6. Great, it's denser. by DWMorse · · Score: 3, Funny

    Great, it's denser. Does this mean it now comes in a yellow-white, almost blonde color?

    --
    There's a spot in User Info for World of Warcraft account names? Really?
  7. Re:Is anybody writing this down? by symbolset · · Score: 3, Informative

    All of the tech we actually purchase comes out of tech published in articles like this one. Processor process technologies, bus evolutions, memory architectures, advancements in lithography are printed here and wind up in the products you buy. Not all of the articles are successful technologies but all of the successful technologies have articles and the time reading about the failures are the price we pay to know about such things in advance. Most of us don't mind, because there are lessons in failures too. Did you read the top of the page where it says "News for nerds."? Are you lost?

    Digg is over here.

    --
    Help stamp out iliturcy.
  8. 25x more dense, not 5x more dense... by StandardCell · · Score: 4, Insightful

    If a single dimension changes, assuming the NAND cell structure is similar, there would be a 5x reduction in size in each of the X and Y dimensions. Therefore, you would get up to 25x more density than a current NAND. This is why process technologies roughly target the smallest drawn dimension to progressively double gate density every generation (i.e. 45nm has 2x more cells than 32nm).

    The big question I have for all of these technologies is whether or not is is mass production worthy and reliable over a normal usage life.

    1. Re:25x more dense, not 5x more dense... by noidentity · · Score: 2
      Just trying to follow what you're saying. You're saying that "X is 200% more than Y" means X=2*Y+Y, but that "X is 2x more than Y" means X=2*Y. I thought that "200%" was synonymous with "2 times".

      Ignoring percentages and simply focusing on "X is two times more than Y" meaning X=2*Y, I'm assuming that "X is 1.1 times more than Y" means X=1.1*Y. Does "X is 0.5 times more than Y" mean that X=0.5*Y, that X is actually less than Y? Would this mean that "X is 0 times more than Y" means that X=0?

      A useful guide I found on this topic: Common errors in forming arithmetic comparisons

  9. Re:Is anybody writing this down? by Anonymous Coward · · Score: 2, Funny

    Shh. One mustn't identify in public The Great Duck, herald and bringer of technology.

  10. Here they come... by LostCluster · · Score: 3, Insightful

    Best Buy and Amazon are both selling Intel's 40 GB flash drive for just under $100 this week... I'm building a server based around it and will likely later post on how that goes. Intel recently announced that they're upping the sizes so you're likely going to see the 40 GB model in the clearance bin soon.

    It's here, it's ready... and when you don't have a TB of data to store they're a great choice, especially when you read much more often that you write.

  11. And if you want a big SSD by symbolset · · Score: 5, Insightful

    And if you do need a big SSD Kingston has had a laptop 512GB SSD out since May with huge performance, and this month Toshiba and Samsung will both step up to compete and bring the price down. We're getting close to retiring mechanical media in the first tier. Intel's research shows failure rates of SSD at 10% that of mechanical media. Google will probably have a whitepaper out in the next six months on this issue too.

    This is essential because for server consolidation and VDI the storage bottleneck has become an impassable gate with spinning media. These SSDs are being used in shared storage devices (SANs) to deliver the IOPs required to solve this problem. Because incumbent vendors make millions from each of their racks-of-disks SANs, they're not about to migrate to inexpensive SSD, so you'll see SAN products from startups take the field here. The surest way to get your startup bought by an old-school SAN vendor for $Billions is to put a custom derivative of OpenFiler on a dense rack of these SSDs and dish it up as block storage over the user's choice of FC, iSCSI or Infiniband as well as NFS and SAMBA file based storage. To get the best bang for the buck, adapt the BackBlaze box for SFF SSD drives. Remember to architect for differences in drive bandwidths or you'll build in bottlenecks that will be hard to overcome later and drive business to your competitors with more forethought. Hint: When you're striping in a Commit-on-Write log-based storage architecture it's OK to oversubscribe individual drive bandwiths in your fanout to a certain multiple because the blocking issue is latency, not bandwidth. For extra credit, implement deduplication and back the SSD storage with supercapacitors and/or an immense battery powered write cache RAM for nearly instantaneous reliable write commits.

    I should probably file for a patent on that, but I won't. If you want to then let me suggest "aggregation of common architectures to create synergistic fusion catalysts for progress" as a working title.

    That leaves the network bandwidth problem to solve, but I guess I can leave that for another post.

    --
    Help stamp out iliturcy.
    1. Re:And if you want a big SSD by adolf · · Score: 2, Funny

      And you, sir, win the Bullshit of the Day award.

      Congrats!

    2. Re:And if you want a big SSD by RivenAleem · · Score: 2, Informative

      more IOPS than god

      God doesn't need any Outputs. It's all one-way traffic with him.

  12. Well that may be problematic by Sycraft-fu · · Score: 2, Interesting

    One thing you could run in to are heat issues. Remember that high performance chips tend to give off a lot of heat. Memory isn't as bad, but it still warms up. Start stacking layers on top of each other and it could be a problem.

    Who knows? We may be in for a slowing down of transistor count growth rate. That may not mean a slow down in performance, perhaps other materials or processes will allow for speed increases. While lightspeed is a limit, that doesn't mean parts of a CPU couldn't run very fast.

    Also it may slow down. Exponential growth doesn't last for ever. We may start to hit the limits of what we can do.

    Have to see.

    1. Re:Well that may be problematic by symbolset · · Score: 2, Interesting

      They're all over that. As the transistors shrink they give off less heat. New transistor technologies also use less energy each per square nanometer, and there's new ones in the pipe. Not all of the parts of a CPU, SSD cell or RAM chip are working at the same time so intelligent distribution of the loads give more thermal savings. Then there are new technologies for conducting the heat out of the hotspots, including using artificial diamond as a substrate rather than silicon, or as an intermediary electrical isolation layer as well as a thermal conductor. If they can solve the carbon or silicon layer deposition issues the thermal issues will be OK.

      An interesting evolution of 3D in semiconductors will be leveraging different parts of the processor in three dimensions. This should resolve many of the speed-of-light and latency issues designers have struggled with for some years.

      --
      Help stamp out iliturcy.
    2. Re:Well that may be problematic by repapetilto · · Score: 3, Interesting

      This might be a dumb question, but why not have some sort of capillary-esque network with a high heat-capacity fluid being pumped through it? Maybe even just deionized water if you have a way of keeping the resistivity high enough.

    3. Re:Well that may be problematic by vlueboy · · Score: 2, Insightful

      L1 CPU caches are shamefully stuck with the laughable 20-year old 640K meme in rarely noticed ways. Everyone's first thought is about RAM memory, but remember that CPU's are less change friendly and benefit more from tech like 128K * 5 size at the new density improvement.

      Our supposedly macho CPU's have only 128K L1 sizes and comparably, absurdly high L2 and L3 sizes to make up.

      The current excuse is that cost and die-space constraints keep size-improvements mostly on the L2 and L3 side. Sadly, someone tagged the article "tenyears" and we'll be dealing with different research by then, like utilizing today's 64 bit, multi-core technology to its fullest.

  13. Re:Is anybody writing this down? by Yvan256 · · Score: 2, Funny

    Nope. Microsoft is that stupid dog that keeps laughing at you when you can't shoot the ducks.

  14. Re:Sigh... by afidel · · Score: 2, Insightful

    Some supercapacitors have made it to market and refinements on lithium technologies have come a long way in the last decade, tripling the maximum storage density available. The problem is our demand for portable power has outstripped that growth (my blackberry is significantly more powerful than my desktop from 10 years ago and talks 6 different wireless protocols).

    --
    There are 4 boxes to use in the defense of liberty: soap, ballot, jury, ammo. Use in that order. Starting now.
  15. so how wide is 5nm? by ChipMonk · · Score: 5, Informative

    The radius of a silicon atom is 111 to 210 picometers, depending on the measurement context. (Check Wikipedia to see what I mean.) That means 5nm is somewhere between 23 and 45 silicon atoms wide.

  16. Will special glasses be needed to read 3D memory? by PatPending · · Score: 4, Funny

    If so, count me out! Besides 3D makes me nauseated.

    --
    What one fool can do, another can. (Ancient Simian Proverb)
  17. looking for high density ROM to stop digital decay by OrangeTide · · Score: 3, Interesting

    I'm still waiting for some cheap, stable, high density ROM or preferably WORM/PROM. Even flash has only about 20 years retention with the power off. Which sounds like a lot, but it's not all that difficult to find a working synthesizer or drum machine from the mid-80s in working condition. But if you put flash in everything your favorite devices may be dead in 20 years. for most devices this is OK. But what if some of us want to build something a little more permanent? Like an art piece, a space probe, a DSP based guitar effects pedal, or a car?

    Some kind of device with some nano wires that I can fuse to a plate or something with voltage would be nice if it could be made in a density of at least 256Mbit (just an arbitrary number I picked). EPROMs (with the little UV window) also only last for about 10-20 years (and a PROM is just an EPROM without a window). So we should expect to already have this digital decay problem in older electronics. Luckily for high volumes it was cheaper to use a mask ROM than a PROM or EPROM. But these days NAND flash(MLC) is so cheap and high density that mask ROMs seem like a thing of the past, to the point that it is difficult to find a place that can do mask ROMs that can also do high density wafers.

    --
    “Common sense is not so common.” — Voltaire
  18. Oblig B5 joke by tenco · · Score: 2, Funny

    Silicon-based lifeforms 5x denser than carbon-based.

  19. There's only so much you need by Sycraft-fu · · Score: 3, Informative

    Cache is not a case where more is necessary. What you discover is it is something of a logarithmic function in terms of amount of cache vs performance. On that scale, 100% would be the speed you would achieve if all RAM were cache speed, 0% is RAM only speed. With current designs, you get in the 95%+ range. Adding more gains you little.

    Now not everything works quite the same. Servers often need more cache for ideal performance so you'll find some server chips have more. In systems with a lot of physical CPUs, more cache can be important too so you see more on some of the heavy hitting CPUs like Power and Itanium.

    At any rate you discover that the chip makers are reasonably good with the tradeoff in terms of cache and other die uses and this is demonstrable because with normal workloads, CPUs are not memory starved. If the CPU was continually waiting on data it would have to work below peak capacity.

    In fact you can see this well with the Core i7s. There are two different kinds, the 800s and the 900s and they run on different boards, with different memory setups. The 900s feature faster memory by a good bit. However, for most consumer workloads, you see no performance difference with equal clocks. What that means is that the cache is being kept full by the RAM, despite the slower speed, and the CPU isn't waiting. On some pro stuff you do find that the increased memory bandwidth helps, the 800s are getting bandwidth starved. More cache could also possibly fix that problem, but perhaps not as well.

    Bigger caches are fine, but only if there's a performance improvement. No matter how small transistors get, space on a CPU will always be precious. You can always do something else with them other than memory, if it isn't useful.