Intel Designs Faster, 3D Transistor

lee1 writes "Intel has found a way to keep on the Moore's Law track by making smaller, faster and lower-power computer chips by building 3D transistors. They are already manufacturing microprocessors using this new design, called a FINFET (for fin field-effect transistor), which incorporates a small pillar, or fin, of silicon that sticks up above the surface of the chip. Intel said that it expected to be able to make chips that run as much as 37 percent faster in low-voltage applications and use as much as 50 percent less power. Products based on the new technology may appear some time later this year."

Comments

its 2D

[aepurniet]

they are not 3D, they are just thinner and deeper than the standard, we still dont see transistors on top of each other. the latice is still pretty much 2D. i ussually dont complain too much, but slash dot summaries are batting way below the mendoza line.

Re:its 2D

[denobug]

they are not 3D, they are just thinner and deeper than the standard, we still dont see transistors on top of each other. the latice is still pretty much 2D. i ussually dont complain too much, but slash dot summaries are batting way below the mendoza line.

No the structure is totally different. Look at how the source, drain, and the gate are arranged. Different geometry here.

The article from AnanTech has the best explanation of the technique I have come across so far today:

http://www.anandtech.com/show/4313/intel-announces-first-22nm-3d-trigate-transistors-shipping-in-2h-2011