Single-Chip DIMM To Replace Big Sticks of RAM

MrSeb writes "Invensas, a subsidiary of chip microelectronics company Tessera, has discovered a way of stacking multiple DRAM chips on top of each other. This process, called multi-die face-down packaging, or xFD for short, massively increases memory density, reduces power consumption, and should pave the way for faster and more efficient memory chips. Multi-die face-down packaging is exactly what it sounds like, with memory dies stacked on top of each other like roofing tiles. Much like a normal desktop DIMMs and laptop SO-DIMMs, each of the stacked dies is wired to each other in series — but in this case, the connections are much shorter, as they only have to run a few micrometers to the chip below it. This is where all of the power and speed enhancements come from: shorter interconnects mean less power is needed (and thus less heat is dissipated) and signals propagate faster."

Comments

Re:when can I expect 4gb SODIMMs?

[wierd_w]

Really? Every place I have looked, only 2gb sticks were available. 8gb sticks would be awesome.

(No. There is no real ambiguity in saying 1gb == 1024mb, 1mb == 1024kb, 1kb == 1024b. The ambiguity was injected by shyster disc manufacturers, wanting to claim 1mb as 1000kb, instead of the correct 1024kb, because they wanted to sell a lower capacity device as larger than it really was. 1gb is 1gb. I refuse to adopt a whole different suffix just because of marketing drones trying to reinvent the term.)