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ARM Expects 20-Nanometer Processors By Late 2013
angry tapir writes "ARM chips made with an advanced, 20-nanometer manufacturing process could appear in smartphones and tablets by as soon as the end of next year, the head of ARM's processor division said Monday. The more advanced chips should allow device makers to improve the performance of their products without reducing battery life, or offer the same performance with longer battery life."
Guspaz, they skipped 22nm and went directly to 20nm as per their original 2010 plan
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http://www.eetimes.com/electronics-news/4088580/TSMC-skips-22-nm-rolls-20-nm-process
"Mark LaPedus
4/13/2010 1:30 PM EDT
TSMC skips 22-nm, rolls 20-nm process
(TSMC) is putting a new spin on its strategy: After the 28-nm node, it plans to skip the 22-nm ''full node'' and will move directly to the 20-nm ''half node.''
At its technology conference here, the world's largest silicon foundry also provided details about its 20-nm CMOS process, which will be the company's main technology platform after the 28-nm node. TSMC will also not offer an 18-nm process.
TSMC's 20-nm process is a 10-level metal technology based on a planar technology. It will feature a high-k/metal gate scheme, strained silicon and newfangled ''low-resistance'' copper ultra-low-k interconnects--or what it calls ''low-r.
'' For the 20-nm node, it will only offer a high-k/metal-gate scheme for the gate stack--and not a silicon dioxide option.
TSMC (Hsinchu) will continue to use 193-nm immersion lithography at 20-nm, but it will also deploy a double-patterning and source-mask optimization schemes.
Unlike its previous processes in recent times--which focused on low power first--TSMC's initial 20-nm process will be a high-performance technology. Following that process, it will roll out a low-power technology.
With the announcement, TSMC is seeking to gain an edge over its leading-edge rivals, such a GlobalFoundries, Samsung and UMC.