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Moore's Law Blowout Sale Is Ending, Says Broadcom CTO

itwbennett writes "Broadcom Chairman and CTO Henry Samueli has some bad news for you: Moore's Law isn't making chips cheaper anymore because it now requires complicated manufacturing techniques that are so expensive they cancel out the cost savings. Instead of getting more speed, less power consumption and lower cost with each generation, chip makers now have to choose two out of three, Samueli said. He pointed to new techniques such as High-K Metal Gate and FinFET, which have been used in recent years to achieve new so-called process nodes. The most advanced process node on the market, defined by the size of the features on a chip, is due to reach 14 nanometers next year. At levels like that, chip makers need more than traditional manufacturing techniques to achieve the high density, Samueli said. The more dense chips get, the more expensive it will be to make them, he said."

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  1. Re:350mm (18inch) wafer by CaptBubba · · Score: 5, Informative

    350 may bring costs down, but it isn't a process node advancement and won't help cram more transistors per unit area into a chip.

    Instead it will just let them process more chips at once in most time-consuming processing steps such as deposition and oxide growth. The photolithographic systems, which are the most expensive equipment in the entire fab on a cost-per-wafer-processed-per-hour basis, gain somewhat due to less wafer exchanging, but the imaging is still done a few square cm at a time repeated in a step-and-scan manner a hundred times or more per wafer per step. Larger wafers however are posing one hell of a problem for maintaining film and etch uniformity, extremely important when you have transistor gate oxides on the order of a few atoms thick.