Intel's Knights Landing — 72 Cores, 3 Teraflops

New submitter asliarun writes "David Kanter of Realworldtech recently posted his take on Intel's upcoming Knights Landing chip. The technical specs are massive, showing Intel's new-found focus on throughput processing (and possibly graphics). 72 Silvermont cores with beefy FP and vector units, mesh fabric with tile based architecture, DDR4 support with a 384-bit memory controller, QPI connectivity instead of PCIe, and 16GB on-package eDRAM (yes, 16GB). All this should ensure throughput of 3 teraflop/s double precision. Many of the architectural elements would also be the same as Intel's future CPU chips — so this is also a peek into Intel's vision of the future. Will Intel use this as a platform to compete with nVidia and AMD/ATI on graphics? Or will this be another Larrabee? Or just an exotic HPC product like Knights Corner?"

Comments

Requires parallelism

[tepples]

Multicore implies more speed only if your process is parallelized. Not all interactive processes on a single-user computer can be, wrote Amdahl.

Re:No it cannot compete with nVidia and AMD/ATI

[rsmith-mac]

"eDRAM" in this article is almost certainly an error for that reason.

eDRAM isn't very well defined, but it basically boils down to "DRAM manufactured on a modified logic process," allowing it to be placed on-die alongside logic, or at the very least built using the same tools if you're a logic house (Intel, TSMC, etc). This is as opposed to traditional DRAM, which is made on dedicated processes that is optimized for space (capacitors) and follows its own development cadence.

The article notes that this is on-package as opposed to on-die memory, which under most circumstances would mean regular DRAM would work just fine. The biggest example of on-package RAM would be SoCs, where the DRAM is regularly placed in the same package for size/convenience and then wire-bonded to the processor die (although alternative connections do exist). Conversely eDRAM is almost exclusively used on-die with logic - this being its designed use - chiefly as a higher density/lower performance alternative to SRAM. You can do off-die eDRAM, which is what Intel does for Crystalwell, but that's almost entirely down to Intel using spare fab capacity and keeping production in house (they don't make DRAM) as opposed to technical requirements. Which is why you don't see off-die eDRAM regularly used.

Or to put it bluntly, just because DRAM is on-package doesn't mean it's eDRAM. There are further qualifications to making it eDRAM than moving the DRAM die closer to the CPU.

But ultimately as you note cost would be an issue. Even taking into account process advantages between now and the Knight's Landing launch, 16GB of eDRAM would be huge. Mind bogglingly huge. Many thousands of square millimeters huge. Based on space constraints alone it can't be eDRAM; it has to be DRAM to make that aspect work, and even then 16GB of DRAM wouldn't be small.

Re:Yay more cores that I won't be using much of!

[morcego]

Because you can never have too many cores that you aren't using most of the time.

Install McAfee Antivírus, and problem solved: no more unused cores.

Re: ipad

[Macthorpe]

To be fair, Apple are very committed to branding.