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Paper-thin Integrated Circuits
EngrBohn writes "According to the EE Times, Toshiba has developed paper-thin IC packages, getting ICs down to 50microns thick. First marketed product is to be ultra-thin flash memories stacked into a SmartMedia card. Envisioned applications include mounting a circuit on a curved surface and, for the conspiracy theorists, a postage-stamp-sized transmitter & antenna that can be pasted to any surface. "
Personally, I prefer the ball semiconductor approach for microelectronics on curved surfaces. :-)
Or for antenna-type structures, go for EFAB.
...and then there's that microphone reported a while back.
--The more you know, the less you know.
The possibility of bendy circuits is the most exciting to me - when I compare my wallet with my Palm III, I find that although my wallet is wider and thicker, it fits in my pocket a lot more easliy, largely because it has a small amount of 'give' and is able to contour (to a small extent) to the curve of my butt.
My Palm III, however won't curve at all and therefore causes me discomfort if I sit down with it stuffed in my back trouser pocket.
Slightly bendy electronics would probably also be a lot more resilient to bangs and knocks, as much of the kinetic energy would be transferred into bending the device rather than snapping it's components.