http://www.boingo.com had an interesting system, but it isn't what we wanted.
We were looking for a system whereby the owner or the Accss Point would give out free limited access to everyone but charge a nominal fee for broadband access with greater throughput.
I was envisioning an EPROM type wafer, slower still I know but much faster still than HD access. This way though the data would survive a power down. CRCs could verify integrity on power on if needed.
Even an inexpensive but small double sided 4.5" wafers would hold a substantial amount of data especially with 6 or more EPI layers on it.
Wafers usually have bad areas on them, and that would be ok too. Just mark them off as bad and store the data allocation table in an off wafer EPROM for retrieval each time the medium was mounted by the OS.
During the mounting process of the wafer to the power leads the entire wafer could be tested and mapped for good and bad sectors. Also, I imagine that there would be multiple mountings around the wafer to help power and transmission issues.
Multiple wafers could be stacked in this manner to achieve more storage per bay. Greater data densities could be achieved when applying newer imaging processes.
800mm wafers are a bit large for this type of application if it was ever intended to be placed into the consumer market though.
The idea for using smaller wafers makes sense over large ones due to the through away nature of the product. One would be expecting some sectors to be blocked off anyway and imperfect wafers would be welcome so long as a certain percentage of them were viable. Flatness may be the only critical factor.
The whole medium would have to be reasonably shock resistant as well, but that's not that hard to solve either by the mounting process.
Next question, how to apply the circuitry to all the unique sectors? What about hard wired appliqué via a laserjet thermal transfer made specifically for each tested wafer?
It's a pet project for someone more technical than me, but an interesting one non the less.
William... be achieved by scaling to smaller circuts
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William...
Thank you I'll check this out. =)
http://www.boingo.com had an interesting system, but it isn't what we wanted.
We were looking for a system whereby the owner or the Accss Point would give out free limited access to everyone but charge a nominal fee for broadband access with greater throughput.
If I couldn't find it I'd be building it.
Sooth...
Have you heard of any open source projects that do the same thing?
Thanks,
Sooth...
Right... Low voltage drops and the like as well.
I was envisioning an EPROM type wafer, slower still I know but much faster still than HD access. This way though the data would survive a power down. CRCs could verify integrity on power on if needed.
Even an inexpensive but small double sided 4.5" wafers would hold a substantial amount of data especially with 6 or more EPI layers on it.
Wafers usually have bad areas on them, and that would be ok too. Just mark them off as bad and store the data allocation table in an off wafer EPROM for retrieval each time the medium was mounted by the OS.
During the mounting process of the wafer to the power leads the entire wafer could be tested and mapped for good and bad sectors. Also, I imagine that there would be multiple mountings around the wafer to help power and transmission issues.
Multiple wafers could be stacked in this manner to achieve more storage per bay. Greater data densities could be achieved when applying newer imaging processes.
800mm wafers are a bit large for this type of application if it was ever intended to be placed into the consumer market though.
The idea for using smaller wafers makes sense over large ones due to the through away nature of the product. One would be expecting some sectors to be blocked off anyway and imperfect wafers would be welcome so long as a certain percentage of them were viable. Flatness may be the only critical factor.
The whole medium would have to be reasonably shock resistant as well, but that's not that hard to solve either by the mounting process.
Next question, how to apply the circuitry to all the unique sectors? What about hard wired appliqué via a laserjet thermal transfer made specifically for each tested wafer?
It's a pet project for someone more technical than me, but an interesting one non the less.
William...
be achieved by scaling to smaller circuts
I have often wondered the same thing. I even worked for a facility capable of doing it too. They weren't interested.
Frankly, I think they were narrow minded and that's why they are soon to go out of business.
William...