Stacking these things is all well and good, but at what point do heat considerations become a primary concern? Lately I haven't gotten the impression that volume of ICs is our biggest bottleneck.
Eventually the 'bricks' will end up with shapes that has the best heat transfer properties, e.g. a 'ring' shaped cpu dipped in cooling liquid.
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Stacking these things is all well and good, but at what point do heat considerations become a primary concern? Lately I haven't gotten the impression that volume of ICs is our biggest bottleneck.
Eventually the 'bricks' will end up with shapes that has the best heat transfer properties, e.g. a 'ring' shaped cpu dipped in cooling liquid.
100 more ways to brick a machine.