There is a parallel advance in cooling technology using liquid based cooling. While this may not seem like a new idea to the/. crowd, integrated fluidic interconnects (analogous to optical or electrical interconnects), would allow a cooling liquid to be delivered to a chip. Researchers at Georgia Tech have demonstrated fluid flow through a chip:
http://www.reed-electronics.com/semiconductor/arti cle/CA604509?pubdate=6%2F1%2F2005&industryid=3028
Connecting the chip to a printed wiring board with fluidic channels would allow an integrated heat removal system without significant need for additional pumping power (only a few atmospheres at low flowrates).
Sounds like a pretty neat idea to me.
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There is a parallel advance in cooling technology using liquid based cooling. While this may not seem like a new idea to the /. crowd, integrated fluidic interconnects (analogous to optical or electrical interconnects), would allow a cooling liquid to be delivered to a chip. Researchers at Georgia Tech have demonstrated fluid flow through a chip:
http://www.reed-electronics.com/semiconductor/arti cle/CA604509?pubdate=6%2F1%2F2005&industryid=3028
Connecting the chip to a printed wiring board with fluidic channels would allow an integrated heat removal system without significant need for additional pumping power (only a few atmospheres at low flowrates).
Sounds like a pretty neat idea to me.