Silicone-based heatsink compound is most definitely not a situation where "more is better".
As an embedded developer with over 25 years of experience, that has also done time as an electronic service tech, I too was appalled at the amount of heatsink "grease" used on the MBP. I would agree that when a proper amount of the stuff is used, the MBP's carefully engineered heat pipe will indeed work far better than with what amounts to a "blanket" between the chip to be cooled and the mechanism that was intended to cool it.
Asustek should know better than this. I'm quite amazed that the compound isn't been "screened" on, which tends to make the human tendency to overapply, moot.
As a Mac user since it was called a Lisa, I am also incredulous that Apple's First Article Inspection processes accepted the first shipment, if it looked like this. However, I would also NOT be surprised to find that, like many manufacturers these days, Apple doesn't do a complete tear-down of units from the first shipment, instead relying on some "trial runs" with their CM (Asustek), which may have had the heatsink compound applied by someone who knew better...
As the parent says, this kind of stuff happens to everyone. As long as Apple makes it right, that's all anyone in their position could do.
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The parent is exactly correct.
Silicone-based heatsink compound is most definitely not a situation where "more is better".
As an embedded developer with over 25 years of experience, that has also done time as an electronic service tech, I too was appalled at the amount of heatsink "grease" used on the MBP. I would agree that when a proper amount of the stuff is used, the MBP's carefully engineered heat pipe will indeed work far better than with what amounts to a "blanket" between the chip to be cooled and the mechanism that was intended to cool it.
Asustek should know better than this. I'm quite amazed that the compound isn't been "screened" on, which tends to make the human tendency to overapply, moot.
As a Mac user since it was called a Lisa, I am also incredulous that Apple's First Article Inspection processes accepted the first shipment, if it looked like this. However, I would also NOT be surprised to find that, like many manufacturers these days, Apple doesn't do a complete tear-down of units from the first shipment, instead relying on some "trial runs" with their CM (Asustek), which may have had the heatsink compound applied by someone who knew better...
As the parent says, this kind of stuff happens to everyone. As long as Apple makes it right, that's all anyone in their position could do.