Slashdot Mirror
IBM Creates New Processor Production Method
Vandermar writes: "IBM's new production method uses an advanced insulation material -- a low-k dielectric -- that protects the millions of individual copper circuits on a chip." Apparently it works at sizes down to 0.13 micron and the insulation itself is primarily silk. IBM says it will be using this technology for its Power 4 processor, but with their technology sharing with Transmeta and AMD can we expect to see this enhancement in their chips?"
If the technique is proven viable, IBM will surely get their patents in a row and start licensing the technology to all comers. Just because they have tech sharing with Transmeta and AMD doesn't mean that Intel, Motorola and Via are not going to be able to get their hands on this. IBM's revenues are not solely from hardware sales, and certainly not from chip sales alone. It is in IBM's best interest to license the patents out to whomever will pay for them.
So, on that note, I do believe that Transmeta and AMD will end up with this technology, assuming it is useful.
From http://www.dow.com/dow_news/co rporate/20000403a.html:
The Dow Chemical Company is supplying IBM with SiLK* semiconductor dielectric resin
This is an artificial polymer with a low dielectric constant. Not the silk used for cloth.
The article also gives a moderately technical description of why a low-k dielectric is a Good Thing.
The industry's been working on low-k dielectrics
for a long time.
The real issue with low-k dielectrics is that they
reduce the capacitance of the onchip wiring.
This has several benefits:
1) Wiring capacitances in general will be
signficantly reduced.
2) Wires running parallel to each other will
have less crosstalk. I.e., if the voltage on
one wire switches, it'll have less tendency to
drag the voltage of wires close to it with it.
This is a result of neighboring wires having
mutual capacitance. --> EASIER DESIGN
3) Since capacitances are reduced, less power
will be needed to cause metal wires to switch
voltage. --> COOLER CPUs, -->LOWER POWER
4) Because of the reduced capacitances, it requires less current to switch wires.
--> FASTER CPUs.
This is a really significant advance by IBM,
maybe more signficant than copper metallization.
One possible problem is poor heat conduction
from die to package, but the tradeoff is probably
worth it.