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The Thermal Paste Revolution
arhines writes "ZZZ is running an article about an interesting new thermal paste which surpasses even solder in thermal conductance by 33 percent. If this paste makes it to the market sometime soon, we'll all surely be thinking about putting it in our boxes. In fact, if use of the paste becomes commonplace, it may even give the semiconductor industry a little speed boost."
according to the article you dont see the 33% improvement until you apply about twice the normal pressure. imagine the cracked cores
bite my glorious golden ass.
Have a look at the instructions for Arctic Silver 3 to see what kind of steps are needed.
Of course we should not forget that Using thermal grease on your Athlon will void your warranty.
Im dreaming ofa big bndwdth, That can resist the
The article on thermal paste is quite interesting, such advances are sure to aid in the cooling levels for the near future. However, I often wonder why there hasn't been much development in the way of devising viable (read: cheap) alternative cooling solutions (e.g water/fliud, air piping, effective passive cooling). It seems that the now archaic heatsink/fan just isn't cutting it anymore, at least down to a bearable level that is (the amount of noise my cpu fan creates is ridiculous).
Part of this is the chip maker's fault, for running the chip too hot/fast. Likewise, part of the fault rests on the case/fan manufacturers, as the cases become increasingly smaller, dealing with cooling becomes harder, as there is less space to work in.
It is getting to the point where I feel that my peace of mind with regards to noise is well worth the sacrifice of speed. After all, I don't need the full power of my cpu most of the time, just when compiling/rendering/encoding. The cpu just isn't the bottleneck anymore, and it's useless to continue in this speed race, not until the other system components catch up. Why doesn't the industry work together to create a better solution? It's high time I'm rid of the constant roar of these machines.
* who runs within 2 degrees of max temp for their CPU? some crazy overclockers, but it's not exactly reliable practice, is it? if it was 10 degrees, maybe but it's not going to make that much difference
* stop knocking the thermal pads. retail CPUs use these because joe sixpack can't f*vck it up and claim on their warranty. if you don't like it, scrape it off and stick a blob of arctic silver or similar
* bear in mind AMDs warranty only applies if you use approved thermal solutions
This may help solve the problem that thermal compound applied badly is worse (in terms of temperature) than none at all.
In a thermal compound we are seeking somethng that:
(1) will conduct heat to the heatsink better than air
(2) will remain inert under extended high temperature exposure
(3) is non toxic (nice seeing as we have to deal with the stuff)
It is difficult for a material to conduct heat better than air if (large or many) air bubbles are present between the two surfaces, trapped by the compound itself.
So we all know how silicone performs, it meets 2 and 3 but there are some issues with 1, mainly because of the air bubble issue.
Carbon black, polyehtylene glycol and ethyl cellulose are both non-hazardous and ethyl cellulose is only mildly hazardous (Material Safety Data Sheets www.merck.co.th, criterion 3 met)
Particulate size is small (should lick the air bubble problem).
Spreadability should be a-ok (ethyl cellulose is a molding compound.
No polymerisation or other chemical reaction should occur (stable mixture, criterion 2 met).
Carbon is a brilliant conductor in this form ( criterion 1 met)
I think it'll work
Copper is a good heat conductor, and that's why it's used to spread the heat to a large surface area. The thermal paste has a different job: It only has to thermally connect the heatsink to the processor. It does not need to conduct heat over comparatively big distances. The kind of gap-filler between the heatsink and the processor is not as important as makers of the only substance which costs more per milligram than inkjet ink would like you to believe (at least as long as it's not air). The gap which the paste has to bridge simply isn't big enough for the paste to make a difference, compared to the thickness of both the silicon processor layers and the heatsink.
It actually will not help much. I've used both generic and that silver based Artic Gold (can't remember if that's the brand or not). I use MotherBoard Monitor to monitor temps on my XP/Game system which is equiped with a SLK-800 heatsink and 80mm fan.
There is a 0 degree difference between using the sivler stuff and the generic goo. I've also swapped from the goo to silver paste on my old dual 700 when replaceing a processor. No measurable difference in heat/performance.
Your best bet with those DSL routers:
Find a good 486 heatsink/fan combo, mix a drop of silver compound with a very small drop of epoxy, then mount the sucker on your DSL router's CPU. Use a bench clamp or book (or some combination) to secure the heatsink/fan overnight while the compound hardens. The next morning, your DSL router should run nice and cool. Keep in mind, if you use too much epoxy in your mixture, that heatsink will not be coming off there. A lighter mix will result in something you can knock off there with the handle of a screwdriver if you ever need to get it off.
I've found old 486 sinks and fans are very handy at cooling off just about anything they'll fit on except for peltier solutions.
If the cost of $5 is prohibitive, check your closet for old computers and find your free parts there.
Yep. If you peeled off that pad first, you would have probably gotten another 2-3 degrees. The pad uses a "wax-like" substance (i.e. a solid a room temperature, but liquid when lightly heated). The problem is with pads is that once you heat them after being installed, the wax-like substance just imbedded itself into all the microscopic cracks and holes on the top of both your processor and heatsink (doing its job). But now it is there, it doesn't just come off when you peel off that pad. It is there, and there pretty much for good, acting as a barrier between your heatsink and CPU and any other better thermal compound you use aftward.
:) ). This will remove the outer layer of the heatsink metal as well as the microscopic cracks and holes on it, which will include your heat-pad substance.
Now, I didn't say it was there perminent, but it is close to it. You can get it off the heatsink, as you simply need to heat up the heatsink (a very hot hair-dryer will do this). Once you heat it up, you can start wiping the heatsink down with a cloth. Or you can lap your heatsink (use several grades of sandpaper to get a polished, flat, smooth surface, usually starting with 100-300 grit paper and working your way up to 1000-3000 grit paper, depending on how "anal" you are
The CPU is almost impossible to fully remove the heat-pad substance. You don't want to lap a modern day CPU, as all you will do is "create" microscopic cracks and holes. Modern CPU's are laser cut and pretty much perfectly flat. There are "some" cracks, but they are much smaller/finer then almost any sand paper you will ever find. You also risk damaging the CPU as the manufacturers now have traces and transistors located micrometers from the top of the CPU surface. Heating the CPU can easily damage it if you are not careful about how hot you let it get. So it is usually very dangerous for you to try to remove the substance from the CPU if you have not already done it several times (or don't mind wasting whatever you spend on that CPU when you need to go out and buy a new one).
We were all warned a long time ago that MS products sucked, remember the Magic 8 Ball said, "Outlook not so good"
Thermal pastes are thermally conductive, not electrically so. In fact, you want them to be a damned good electrical insulator. If you'd read the article (I did several days ago- [H]ardOCP had coverage of this one earlier this week...) you'd have found out that carbon black, the substance in question, outpaces pretty much everything else (including diamond and nanotube based compounds in development) because it fills the gaps between the heatsink and the chip's heat spreader, etc. with thermally conductive materials better than anything else.
I am not merely a "consumer" or a "taxpayer". I am a Citizen of the State of Texas