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On-CPU Peltiers From AMD?
Hack Jandy writes "Remember those people who lived on the edge and put peltiers between their CPU and heatsink (or your favorite beverage)? A peltier is a devices that gets cold on one side and warm on the other when an electrical current passes through it. It looks like there is talk that AMD will actually incorporate some of these devices on the CPU according to Xbitlabs. AMD already incorporates some degree of the peltier effect with it's Silicon on Insulator."
Actually, the funny thing is, this hasn't been true for years. Intel CPUS put out quite a lot more wattage (~90w) compared to AMD's top end silicon, around 70 watts. But it made for a mildly funny joke back when the t-bird was spanking the socket 423 chips.
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Just imagine the amount of power required for something like that. Each core of a dual core 65nm CPU will need at least 70 watts of power, giving 140 watts total. In order for a peltier to be useful, the wattage has to be greater than that of the CPUs. So with only the CPU and Pelt, that is a minimum of 300 watts, with something between 400 and 500 being more likely. That is an absurd amount of power and heat.
eclecti.cc
i don't think the realiability is the real issue.
it seems xbitlabs is just.. well.. doing what journalist wannabees like - take some facts and twist them.
for one: YOU DON'T GET MORE -EFFECTIVE- cooling with peltiers. you end up using more power than you would with normal cooling. the total heat output gets _increased_.
unless they(chips) can't work in normal room temps there's not really much point in using peltier cooling in cooling them, except if you somehow manage to get the effect 'for free' or something.
world was created 5 seconds before this post as it is.
AMD is patenting this as a way of *getting around* of SOI disadvantages. SOI means silicon on insulator , which is in this case SiO2, which is also excellent thermal (not only electrical) insulator. AMD says that SiO2 conducts heat at least hundred times less than silicon.
What they are saying is that transistors on SOI might behave better, but they are certainly running hotter than their classic countepairs, since layer of SiO2 stands between them and the cooling system.
So AMD is proposing several schemes of embedding TEC device into the insulating layer in the silicon. This layer would:
1. Decrease overall thermal resisstance of the cooling path
2. When powered on, offer bigger thermal diferential, since it could cool embedded side of the TEC significantly below the cooler temperature.
It is unclear if they intend to use this on the whole chip, or just the especially hot areas...