Reduce Transistor Power Consumption
revelCyllufyalP writes to tell us that University of Kentucky researchers have discovered a way to reduce the overall power consumption of transistors. From the article: "In order to improve computer chips' performance, transistors' size and gate insulators have to be continuously shrunken so that more components can be packed into a single chip. Computer chip producers were hitting a wall in downscaling the transistors and gate insulators because of their inability to reduce the leakage current of the existing gate insulators. This new technique will help the chip producers to develop more powerful chips with low-power consumption."
This may not sound like that big a deal, but let me assure you this is very significant to wireless infrastructure enhancement. One of the biggest limiting factors in wireless devices is power consumptions, so this is great news for the industry!
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The press release says they're getting several orders of magnitude less tunneling current through gate insulators. But tunneling happens because some portion of the electron's wavefunction extends to the other side of the insulator. Whst are they changing that would affect the physics? Or are they fixing a different kind of leakage and getting the press release wrong?
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As probably one of the few semiconductor geeks on /., I have to say: Where's the news? Gate dielectrics are always made with rapid thermal processing on current technologies. Basically, stick a wafer in a chamber, flow some gas, turn on some super-high intensity
lamps, heat the wafer to >1000C for a very brief time, grow a few atomic layers of silicon dioxide (or some variant that includes nitrogen), turn off lamps, cool wafer, take it out of chamber.
From what little info is in the press release, it doesn't sound like they're doing anything revolutionary, so I'm curious why they claim they can reduce gate leakage by so much.
Gate oxides in current microprocessors are around 1.2-2 nm and are grown using RTP (rapid thermal process). A furnace oxidation is too fast. So yes industry already uses rapid thermal anneal (as suggested in TFA) for their gate oxides. Can anyone tell how is the new ?
What this really means is that the next generation has just become possible. As an incidental side benefit, current-generation laptops will be able to run cooler.
Heh...for just a second as my eyes hit the headline, I thought that the researchers had discovered some "direct tunneling" from Kentucky to the United Kingdom.
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What you have to remember about heat is that electronics only get hot because they are never perfect conductors nor perfect insulators {though we can make nearer-perfect insulators than we can conductors}. A perfect conductor will never get hot, no matter how much current you put through it, because the voltage drop across it will be nil and power = voltage * current. Nor will a perfect insulator, because this time, the current through it will be nil.
..... hopefully a fuse.
CMOS is based around two transistors, a P-channel FET which goes conductive when the gate is driven low, and an N-channel FET which goes conductive when the gate is driven high. The P-FET is trying to pull the output high and the N-FET is trying to pull it low. Both the gates are joined together, and this is the input. This is a simple NOT gate.
For a NAND gate, where any input 0 will drive the output to a 1, we have several P-FETs in parallel trying to drive the output high, and so many N-FETs in series trying to drive the output low. Each P-FET gate joined to an N-FET gate is one input. When they are all high, all the N-FETs turn on allowing the output to go low; when any one is low, the chain of N-FETs is broken, one or more P-FETs turn on, and the output goes high. For a NOR gate, where any input 1 will drive the output to a 0, we put the Ns in parallel and the Ps in series. You can make AND gates from NAND+NOT, OR gates from NOR+NOT, and any other combination you like. In fact you really don't need both NAND and NOR, because you can make either one out of the other; but it turns out they're equally as easy to make as each other in CMOS {not like many other technologies}.
In an ideal world this would never dissipate any power, since the input cannot be high and low at the same time so only one of the transistors will ever be on. In practice what happens is that the gates act like capacitors which take a finite time to charge and discharge. They do not switch instantaneously from conductive to non-conductive. So one stops conducting while the other is starting to conduct, and for a brief instant while the inputs are changing state both transistors are conducting a little. It's not a dead short circuit of course, otherwise something would give way
Now every time something changes state, you get a little pulse of heat. Which is why fast processors need cooling. Additionally, to make sure that the logic gate output has changed state before the next clock pulse, you need to make the gate capacitances charge up quickly -- which means using a higher voltage than you could get away with at lower speeds. But 2x more volts means 2x more amps means 4x more watts.
Smaller transistors should have less gate capacitance, and so be capable of switching more quickly.
"It was really simple," said the researchers at the University of Kentucky. "We siply asked the Flying Spaghetti Monster to fix the problem for us, and He did." </flamebait>
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Anyone know? For once Wikipedia isn't much help.
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A quick lesson in quantum physics:
Basically, tunnelling occurs because an electron can get from one side of a potential barrier to the other without ever being in the forbidden region (the width of the barrier, where the potential energy exceeds the total energy of the electron) due to it existing as a wavefunction that does not collapse until you observe it. Anyway, the chance of an electron penetrating a simple potential barrier like the gate of a transistor is a function of the height of the barrier (voltage applied to the gate), the width of the barrier (gate length), and the energy of the electron (voltage across transistor + electron thermal energy).
So ways to decrease tunnelling include:
Just my $0.02 since if I knew for sure I'd be making 6 figures somewhere and not applying to grad schools...
C# _is_ a bit more high-level than C, or for that matter, assembly, which is the language they should be learning.
The system had the verbosity of HTML combined with all the readability of compiled assembly viewed as bitmap images
Assuming they really have discovered a way to lower power consumption (forgive me for not understanding semi-conductor principles) would it not be applicable to other semiconductors? I immediately thought about cell phone/mp3 player battery life and other such things. Even so far as to think about laptops. I (roughly) understand the not-so-much-wasted-power train of thought, and heat reduction from a CPU core and all, but wouldn't this have just as much effect on battery-powered devices? Or am I just being an ass again?
Of course power flows through capacitors! You've got charges, you've got voltages, you have that charges flowing from one side to the other with a voltage on them in a certain amount of time, charge * voltage / time = power. If you couldn't transmit or modulate some power, you couldn't transmit or modify a signal. That's basic thermodynamics: if you can't transmit power, you can't transmit a signal.
The "work done" is, to some extent, recoverable when you change the state of the MOS transistor by discharging them. But that work is usually wasted and thrown away by simply discharging it to ground, then recharging it from the power supply, and that energy has to go somewhere and come from somewhere. But that can happen more in the power supply, and to some extent happens as electromagnetic radiation. You can't get rid of those two problems until you start playing with superconductors.
The heat and loss issues these researchers try to deal with are wasted work, trickle currents of keeping the transistor gate signals charged up as electrons leak away from the gate part of the transistor into the signal part of the transistor. They're nasty problems, taking constant current to keep even static signals active and wasting power as heat that has to be dealt with by some means.
considering the fact that static (leakage) power should be
the real killer in microprocessors is the dynamic power - for wireless/dsp/ucontroller type applications, it could be pretty huge
honestly, the article has so few details it's impossible to tell what they're really doing, but i am pretty sure that most companies out there already use RTP on there gate oxide...
This just tells us that future technologies are not going to have twice the leakage power as current technologies. This doesn't mean that future process technologies are going to have less leakage power than the current ones.
Sometimes I doubt your committment to SparkleMotion!
Yes, power dissipated is V*V/R or VI And yeah, smaller transistors have lower resistance. But smaller gates mean less power, not more. You need less current to move the charge in and out of a smaller transistor (since the charge is smaller). So the "I" in the "VI" can go down. Well, that "I" is really a "V/R" (current across a resistance), so lowering that I really means you can reduce the "V". And since the total power is V*V/R, that means the total power used drops drastically.
Let me explain it a little better because I think I even confused myself.
Power is V*I. The I is V/R. Lowering this R means the V/R value does get bigger (current goes up). But also, since the I only needs to be sufficient to fill or drain a gate in a given amount of time (one cycle), you can reduce the V until V/R is a more reasonable value. And when you lower that V you're also reducing the other V in the power formula (V*V/R), so in fact instead of power going up, it goes down greatly.
For a much easier corollary, look at AMD's 130nm CPUs against their directly equivalent 90nm versions. The 90nm versions take half as much power.
Today's nuclear CPUs are mainly because there are so many transistors switching so fast in such a small space. If you built an old-type CPU using 90nm technology (like an Z80 or something) it would take far far less power than the old ones, which ran off of +5V (plug that into V*V/R!). Additionally, current CPUs have a lot of leakage current, something that CMOS didn't have a problem with until we got to sub 180nm processes. Compare a current CPU to an old NMOS or even ECL processor. You'll see how leakage was a problem before and how much of a savior CMOS was.
Additionally, the megahertz race is not over. It may not be the current concentration of vendors, but as chips go to smaller and smaller feature sizes, they naturally get faster. So even with little concentration on speed, we'll still see a rise in individual core speed.
A 1000-thread (simultaneous) chip is a ridiculous idea. That means you have to duplicate every transistor in the chip (like registers) 1000 times. That makes no sense. You will never reach the same speed as current single processor chips with a 1000-thread CPU (at least not right now). A small number of cores is a better idea at the moment.
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This news has made me very depressed.
how can I now be a cook at the same time as programming?
Before my Pentium 4 generated heat enough for frying eggs and I'm sure in a few years I would be looking for recipes suitable for heat generated by nuclear reactor( charcoal egg comes to mind) but now me dream is gone. Damn you University of Kentucky researchers. I hope we never meet