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3-D Flexible Computer Chips

Posted by ryuzaki0 on from the new-lego-on-the-block dept.

Roland Piquepaille writes "Engineers at the University of Wisconsin-Madison have isolated a single-crystal film of semiconductor from the substrate on which it is built. Then they transferred this very thin film — 200 nanometers thick — on plastic. Both sides of the film can host active components and several layers can be stacked, opening the way to very powerful 3-D flexible computer chips. Besides computer chips, this technique could be used for solar cells, smart cards, RFID tags or active-matrix flat panel displays."

1 of 85 comments (clear)

  1. This is new .. how? by Bender_ · · Score: 5, Informative

    This is not new - this is known as "susbtrate transfer process" and has been practiced for year. One company doing very advanced work in this is Philips:

    First two paper hits I found in google:

    http://retina.et.tudelft.nl/data/artwork/publicati on/hf/ectm013.pdf
    http://retina.et.tudelft.nl/data/artwork/publicati on/hf/111568631.pdf

    Many companies are also working on substrate transfer processes to build silicon wafers with selective crystal orientation. Among them IBM and Soitec.