3-D Flexible Computer Chips
Roland Piquepaille writes "Engineers at the University of Wisconsin-Madison have isolated a single-crystal film of semiconductor from the substrate on which it is built. Then they transferred this very thin film — 200 nanometers thick — on plastic. Both sides of the film can host active components and several layers can be stacked, opening the way to very powerful 3-D flexible computer chips. Besides computer chips, this technique could be used for solar cells, smart cards, RFID tags or active-matrix flat panel displays."
Heat dissipation is a major issue in cpus.. imagine if you could integrate your cpu within the heatsink's mesh at a monocrystaline level.
It would be a revolution in cooling efficiency.
VLC FOR MAC IS DYING! IF YOU DEVELOP, PLEASE SAVE IT!!
$1000.00 clothing just like supermodels
You're going to look awfully silly walking around wearing nothing but one shoe.
KFG
This is not new - this is known as "susbtrate transfer process" and has been practiced for year. One company doing very advanced work in this is Philips:
i on/hf/ectm013.pdfi on/hf/111568631.pdf
First two paper hits I found in google:
http://retina.et.tudelft.nl/data/artwork/publicat
http://retina.et.tudelft.nl/data/artwork/publicat
Many companies are also working on substrate transfer processes to build silicon wafers with selective crystal orientation. Among them IBM and Soitec.
In other news Geeks overclocking clothes causes fire and personal injury.
They say this can be used for solar cells too. Imagine what 300 billion dollars investment could have done to make this a reality. We're like the 3rd generation of rich kid, the one that pisses away the fortune on gambling and yahts instead of doing something productive with it.