AMD Announces Quad Core Tape-Out
Gr8Apes writes "The DailyTech has a snippet wherein AMD announced that quad core Opterons are taped out and will be socket compatible with the current DDR2 Opterons. In fact, all AM3 chips will be socket compatible with AM2 motherboards. For a little historical perspective, AMD's dual-core Opteron was taped out in June 2004, and then officially introduced in late April, 2005.' AMD also claims that the new quad processors will be demo'd this year. Perhaps Core 2 will have a very short reign at the top?" From the article: "The company's press release claims 'AMD plans to deliver to customers in mid-2007 native Quad-Core AMD Opteron processors that incorporate four processor cores on a single die of silicon.'"
Per TFA, "completion of the design". I was also confused by this phrase in the summary.
Ben Hocking
Need a professional organizer?
Tapeout is basically when the processor design process is completed and the final plans are written down to be sent and manufactured. They call it "taping out" because they used to write the specification data to magnetic tape.
I'm interested to see if software companies who license their software by CPU will continue to define a "CPU" as a physical socket, or a core. Right now Microsoft and VMWare (and lots of others) define a CPU as a physical socket, not a core. So a dual core processor only counts as one CPU for licensing purposes.
It will suck if they start realizing how much more money they could be making by defining a core as a CPU for licensing...
Its sort of going gold, with the exception that the latency is MUCH longer.
So even if a perfect, working design tapes out, it will take at least 3months until happy little chips come out at the other end of the factory. Of course, failures, bad yields or bugs that only manifest themself in the physical design can delay this further.
HI O WISE PRINCE. WHT TOOK U SO DAM LONG?
I am glad to see AMD making progress on its quad core chip. No longer can megahertz bring mega bucks. Moore's law doesn't mean Moore money. (Ok, I'll stop now.) We have seen more chip innovation over that past 4 years than I thought was possible.
In case you are wondering what the differences are between AMD and Intel in quad core designs, this comes from TFA:"Intel has recently accelerated its quad-core plans; the company recently announced that quad-core desktop and server chips will be available this year. Intel's initial quad-core designs are significantly different than AMD's approach. The quad-core Intel Kentsfield processor is essentially two Conroe dice attached to the same package. AMD's native quad-core, on the other hand, incorporates all four cores onto the same die."
I cannot wait for comparative benchmarks. I wonder how much ground Intel will gain by being first to market.
Information wants a fueled airplane waiting at the hangar and no one gets hurt.
Isn't AMD depending on additional cores to beat Intel's performance similar to how Intel's Prescott depended on additional MHz to beat AMD's performance?
Sounds like the shoe's on the other foot. I hope AMD brings back the kind of engineering innovations that brought it support among those in the know back in 1999 and 2000.. (Like focusing on a superscalar architecture with the K7.)
Four cores is a fine concept, but they mustn't forget to increase the capabilities of the individual cores.
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Its probably when they tap the chip assembly tray out so they fall to the counter. Just like muffins.
I'll just use my special getting high powers one more time...
Tapeout is when the designers are finished with deciding where all the transistors and such are on the chip (layout), and the layout data files are sent over to the mask-maker to be changed to the masks (basically things you shine light, xrays, whatever through in order to put those designs on the chips during fabrication). Long long ago, actual tape was used for masks.
Way back in the 1960's the way you designed a printed circuit board, or an integrated circuit, was to get a big piece of clear plastic and lay out the lines with red tape. They used red tape so you could see through it, in order to align the tape exactly over the layer below ( most PC boards use at least two layers, IC's at least 5 layers.) As you can imagine, a rather tedious, error-prone process.
When you were done with the tape and exacto knifes, you'd hand the plastic over to the foundry guys, who would photographically reduce each layer to the appropriate microscopic masks.
Sometime in the mid 70's, computers and optical printers got cheap and good enough so you could actually design the lines and layers on a COMPUTER SCREEN. Sales of red tape went way down. Nobody missed the red-tape days.
Nowdays just about everything is computerized in this process. THere's never a plastic sheet or tape or paper stage-- the bit images go directly form the design mprogram to the foundry.
But they still say "The design got "taped out"."
It took AMD a very long time to create a low-wattage version of the dual core 280. With four cores burning away on the new chip, I wonder how efficient putting a quad-core chip on a server board will be. Right now, most servers are running more than 80W per chip, making for a massive thermal dissipation problem. There's a lot of heat to shunt away from the chip, after all.
.. 25W .. over having a quad core monster at over 140W!
I'd rather have an ultra-efficient dual core chip, sayyyy
"Don't worry about the problems you have in mathematics, I assure you mine are much greater." - Einstein c.1919
The plans themselves being the masks used to create the various layers in the silicon. These mask sets were in times past designed by placing colored pieces of tape onto paper. I'm not certain, but I think the term "tape out" actually refers to those bygone days of literally "taping out" the mask set.
The enemies of Democracy are
The next step after using mylar and rubylith was using CAD, and sending a nine-track magnetic tape of the data to the foundry. So "tapeout" came to mean writing the final magnetic tape.
Nowdays, of course, the data is usually transferred over the internet, so no tape of any kind is involved (not even duct tape). But it is still called tapeout for historical reasons.
Citing similarities between blade counts in razors and processor counts in servers, Gillette began acquiring shares of AMD in a hostile takeover bid.
A signature always reveals a man's character - and sometimes even his name. -- Evan Esar
Tapeout, a.k.a. RIT (Release-In-Tape) is just an old term, similiar to RTM (Release to Manufacturing), which is becoming obselete for software. It seems that semiconductor design terminology has a much longer life than the chips-- we still call design rule checking programs, "DRC decks." Why a "deck?" Remember punch cards? Speaking of cards, that's a netlist.
My favorite's "kerf," the area between chips on a wafer that is lost when they're diced. The term was borrowed from sawmills.
Who do you get to be an expert to tell you something's not obvious? The least insightful person you can find? -J Roberts
Wonder how long it will take for compilers and languages to catch up with the concurrency challenges. Till then, applications will run slower than ever.
[On the desktop, multimedia players, browsers, compilers, IDEs, how many of them will use those cores? Servers seem to be ready though.]
Life is a conviction.
And when will Gillette-Intel come out with its five-core Fusion system with the patented "Serving Surface" for a close and comfortable network solution?
Rob
In fact, all AM3 chips will be socket compatible with AM2 motherboards
This is precisely why I recently purchased an Athlon 64 X2 instead of a Core Duo despite glowing reviews of the latter. The Duo is on Intel's ancient 478/775 sockets whereas X2 is on AMD's new AM2 socket. How many more processors can Intel jimmy into those tight little PGAs? AM2 will have legs for years to come while early adopters of Duo will be buying new motherboards with their next CPU upgrades.
I've gotten conflicting answers from people in industry, often seemingly related to how old they are (and thus whether they'd have been around for the actual-tape-mask phase), which is why I said I wasn't sure. Since "tape out" with magnetic tape would still be somewhat of a euphamism whereas "tape out" with real tape is literal, I'm still not convinced it refers to magnetic tape.
The enemies of Democracy are
I don't think that magnetic tape was involved in the original process at all. As Chris Burke said, the masks were layed out with colered tape on a drafting table. When they were completed they were photographicaly reduced to the size needed to be transfered to silicon for etching. My father used to design printed circuit boards the same way.
"Prefiero morir de pie que vivir siempre arrodillado!"
Write your code in Java. Concurrency utilities are built right into 1.5 on up. With these processors, it should no longer be an issue...
;)
Now I know I just lost any karma this story might have gained me....
The cesspool just got a check and balance.
Having designed a couple consumer devices where we had to burn silicon, I can say the grandparent post is the correct one. "Taping Out" is a referance to the stamp having been successfully created. This used to be accomplished by using lenghts of electrical tape on sheets of glass, but the templates I have taped-out (and I assume the rest of modern templates) are done by silk-screening the pathways directly onto high-temp plexiglass.
Erutangis ym si siht.
Wake me up when AMD has 65 nm scale cores. The vast majority of Dou Core 2 Duo Conroe Core whatever performance and efficiency gains are due to the differences between 90 and 65 nm features. Smaller scale means more execution units and more sophisticated cache logic on the same die. Until AMD does 65 nm their products will be either too hot or too slow.
We've been at 90 nm for so long people almost forgot what a massive improvement a smaller node size can make. Various AMD 65 nm engineering samples are floating around Asia and AMD has made announcements about various 65 nm models appearing Q4 06, early 2007. This is the real battle. However, no mention of what these quad-core parts are supposed to be using...
Lurking at the bottom of the gravity well, getting old
Honestly, can you use 4 cores in any of your current applications? I think the time is coming when the 30 year trend in faster CPUs will end. If you can't increase the mega-herts, and extra cores don't actually improve application performance, what will Intel and AMD do to keep improving their products? I wrote an essay with some possible ideas: Computers in 2020
augment your senses: http://sensebridge.net/
Rarely has a CPU gone from tape-out to production in three months. In fact, I'm pretty sure it's never happened. GPUs do it from time to time, but the thing about any new piece of highly complex silicon (especially a quad-core CPU) is that it will take time to get the process correct, even if there are no bugs or glitches in the design. GPUs, while big, are relatively simple by comparison. On average it takes 9-12 months from tapeout to retail availability, though it has been known to happen in as little as six months.
No, it isn't just you. XP home has no support for SMP whatsoever and XP pro only has SMP support for 2 cpus. if you are running XP home, it would not be very surprising to me if the OS got confused by the multiples cores and failed miserably. If you want to test the stability of th hardware, it may be a good idea to get knopix and see how stable that it, since the kernel usually has SMP support inbuilt.
PS:My knowledge in windows SMP support is fairly dated to somebody please correct me if I am wrong.
It's half-assed of /. summary to say the above without even a mention of Kentsfield, which will probably beat AM3 to market with 4 cores in a single package. Next time give us the whole ass.
"It's the height of ridiculousness to say for those 9 lines you get hundreds of millions."
Back before the dawn of time, when we didn't have dirt yet, we "cut rubies" (used Exacto knives and straightedges to cut Rubylith). People still use Rubylith to do fabric silkscreening and such. No colored tape on paper, not dimensionally stable and not enough contrast for camera-reduction.
-Jay-
They won't care until one performes significantly better than the other.
Conversely, it's rash of you to make TBBA's. (That's Truth by Blatant Assertion). Let me show you how that works, prior to Core 2 - It's rash of you to say the new CPU with 2 Intel cores will beat 2 AMD cores, since even a single AMD core already trounces the Pentium Dual Core CPU.
It completely ignores all relevant facts. The new AMD cores will most likely be 65nm, putting them on the same footing as Intel's new chips. The AMD quad to Intel quad can be closely compared to the previous Intel Pentium "Dual Core" - 2 slapped together cores - vs AMD's dual core on a single die. Many of the same dynamics exist, with one major difference - AMD is doing with the quad what Intel did with the Core 2 - the AMD quad is sharing 4MB of L3 cache. That's one more level than Intel's offering, btw. Intel's quad will be 2 Core 2's slapped together, sharing a single FSB. AMD doesn't have a FSB bottleneck. Anandtech's review of the Core 2 comes up just short of stating that the FSB is going to bottleneck Intel's 2P system (Woodcrest) probably, and wisely, waiting until 2P benchmarks come in. We're all waiting on those, as they will reveal much.
In any case, I am speculating and stated as much as I backed my speculation with what information has been released to date. You are free to draw your conclusions however you'd like, but do so with some basis on known facts.
The cesspool just got a check and balance.
Actually the term "kerf" is indirectly drawn from saw [i]blade[/i] manufactueres, wherin they termed the width of a blade the kerf. Mills originally called the material lost to blade width Kerf Loss which eventually just got shortened to Kerf. [br][br] The material generated of course, being saw dust. Now days, mountains of saw dust are turned into presto logs and fire starters, for as much of a return as the wood itself in some cases, sometimes more, depending on the wood, so kerf loss is a thing of the past(unless your a carpenter).[br][br] Anyway, I digress, technically the term is directly applicable to the chip industry since their blades have a kerf of their own. No borrowing necessary.
... what did you expect, something profound?
If you don't fundamentally understand parallelism, Java isn't going to help you. I mean, so it's got a "synchronized" keyword. So what? You've still got to know at what granularity you want to synchronize stuff, you've still got to avoid deadlocks and race conditions, etc.
The only thing hyping Java as a magic silver bullet will do is encourage the creation of a lot of buggy threaded code.
"[Regarding the 'cloud,'] ownership was what made America different than Russia." -- Woz
What I'd really like is asymetric cores... something like a really power efficient simple 1Mhz core, but when needed, a more powerful 2Mhz core steps in... then a 4Mhz core, then 8Mhz core... The box can have like 32 cores, each one 2x as fast as the last... (oh, I wish!) while 99.9% of the time, you're only using the simple 1Mhz one (ie: how much cpu power does it really take to update the clock?).
(it doesn't have to start at 1Mhz... it could start at 100Mhz, jump to 500Mhz 2nd core... 1Ghz 3rd core... and 2Ghz 4th core---so an idle CPU would use very little power).
Besides, most of the time, you won't use the cores equally anyway. You'll likely run 1 "heavy" app (some game), and a few very light ones.
"If anything can go wrong, it will." - Murphy
All this multi-core stuff is great, but is software keeping pace? It's nice to multitask more quickly, but unless I am mistaken that extra core doesn't help when you are playing a 3d game.
(I read that Unreal's upcoming "Gemini" rendering engine will be multi-threaded on the PS3. Hopefully that'll mean it supports multiple procs on the PC too.)
you should really be using tar(1) for that.
Does your motherboard have onboard sound? Is onboard sound enabled in the bios? If you use a plug-in sound card (like your Audigy), you have to disable the onboard sound in your bios. Hopefully that resolves your sound card issue, otherwise, I'd say it's either a driver issue or else the sound card needs to be reseated. If you're using windows XP 64bit, this is your most likely culprit, the 64bit drivers are horrible IMO.
Have you run memtest86+ to make sure your ram is okay? Have you correctly configured all your ram timings in the bios? Bad ram or incorrect ram settings in the bios will cause instability/crashes/lockups.
Do you have the AMD dual core drivers and AMD dual core optimizer and the Microsoft Dual Core patch for Windows XP installed? With these installed I have 0 problems with any of the games I play (Warcraft3, UT2004, GTA San Andreas, Oblivion (buggy on it's own), SimCity 4, Call of Duty 2, to name a few..).
Here are my specs:
Antec Sonata II case (comes with an Antec SmartPower 2.0 450watt psu)
Athlon64 X2 3800+ (socket 939)
MSI K8N NEO4-F mobo (bios ver 1.C)
2gig Kingston DDR400
250gig Western Digital HD
A cheap $30 Audigy 2 sound card
I went with socket 939 since AM2 wasn't out yet and I avoid getting first-gen tech (wait a few revisions). Just curious, are you using the 64bit of Windows XP?
Back in the mid-60's people were using black crepe-paper tape (like masking tape but black and stretchy) for laying out PC boards. Being 'stretchy' allowed it to bend around corners. Large sheets of clear film were used and aligned front to back by punching a hole in the sheet corners with a 1/4 inch diameter pins to keep them lined up. Then the board pattern was taped onto the sheets of film; topside on one layer and bottomside on another. A few designs used more layers. Mostly these were 4X actual size. These taped sheets were then reduced in a photo darkroom and used to make a glass photo-mask of actual size.
However alignment remained a problem, so some company came up with the process of using red and blue plastic tape for the front and back sides of the board and these were both put on the same large piece of 4X plastic sheet. That way the front and back were always in alignment. A red or blue filter was used in the photo lab to expose only one of the colors for each layer.
The same processes were used for large IC's well into the '70s and pictures appeared on covers of various publications when the 6800, 6500, and 8085 processors hit the market. I was not in the semi-conductor industry, but I have never read any article that said a board was "taped-out" when it was put on magnetic tape for manufacturing. It was nearly always used to tell management that the physical board layout was nearly complete and ready. Sometimes the taping took weeks.
When large high-resolution computer moniters became available, the red-blue became obsolete and the board design went straight to magnet tape for the Gerber-Plotter. However, I never heard any person refer to this as being "taped-out".
AMD will really miss an opportunity if they call the new chip anything other than Tetrathlon.
-- Ed Avis ed@membled.com
I think the phrase referred to in times past, when the design for a chip was literally made into masks for the photo-etching process by taping patterns onto plates.
Now you'd probably have to go to a museum to actually see this being done (or to somebody who was doing it as a hobby or project, which is where I've seen it), but the language has stuck.
When a design has been "taped out," it's basically ready for production; it's ready to be actually etched into the silicon and for the manufacturing process to begin.
"Ladies and gentlemen, my killbot features Lotus Notes and a machine gun. It is the finest available."
Would not want to literally tape out one of these beasts :)
Tyan had a 4-sockets K8 motherboard for 1U servers. You would have 16 cores/1U, which means 80 cores per 5U. Definitely better !
willy