Building Chips Like LEGO
MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."
The patents on Lego expired a few decades ago. They recently tried using trademark law as a work-around, by trademarking the arrangement of dots on the surface of their bricks, but it didn't stand up in court.
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