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Building Chips Like LEGO

Posted by Hemos on from the i-need-the-yellow-capacitor dept.

MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."

1 of 50 comments (clear)

  1. Slow news day? by chiefer · · Score: 0, Offtopic

    Wow, must be a slow news day. As we all know, noone has EVER stacked components in a microprocessor before..[a href = "http://en.wikipedia.org/wiki/Integrated_circuit#S SI.2C_MSI.2C_LSI"]linky [/a]