Cooling Bags Could Cut Server Cooling Costs By 93%
judgecorp writes "UK company Iceotope has launched liquid-cooling technology which it says surpasses what can be done with water or air-cooling and can cut data centre cooling costs by up to 93 percent. Announced at Supercomputing 2009 in Portland, Oregon, the 'modular Liquid-Immersion Cooled Server' technology wraps each server in a cool-bag-like device, which cools components inside a server, rather than cooling the whole data centre, or even a traditional 'hot aisle.' Earlier this year, IBM predicted that in ten years all data centre servers might be water-cooled." Adds reader 1sockchuck, "The Hot Aisle has additional photos and diagrams of the new system."
Seriously. What do we do when a RAM module or a backplane fails? Will a simple hardware swap become a task for those trained in hazmat handling? I do not want to be on the help desk when someone calls and says "Help! The servers are leaking!"
I judt got a nre Kinesis keybiartf so please excusr ant egregiou typos.
In winter you'd get quite a few kilowatt hours worth of heating if you route the dissipated heat properly.
Face your daemons!
Hmm... The Cray-2 was cooled via complete immersion in Fluorinert way back in circa 1988. I was an admin on one (Ya, I'm old). So, this is a bit different, but certainly not ground-breaking.
It must have been something you assimilated. . . .
The idea that the mainboard components are sealed inside a liquid-filled compartment seems like a major point against the system. Extra proprietary vendor lock-in components mean extra costs of owning and operating, which probably offset any savings from cooling... if any.
I'm skeptical that it will significantly reduce cooling costs (Compared to, say, a chilled cabinet system) because the total cooling load stays the same. If you're generating a billion BTUs of heat you still need to remove a billion BTUs of heat. Any savings will only be from the higher energy densities water allows versus air and maybe initial installation.
Plus, based on their exploded view, there is no less than three heat exchanges before it even gets out of the cabinet: Chip to liquid (via heat sink), submersion liquid to module liquid, module liquid to system liquid. Each time to go through an exchange your temperature gradient goes up.
What they need is a system that is compatible with commodity components to leverage low cost hardware against lower cost cooling. Why not fit water blocks directly to existing mainboard layouts and circulate chilled water from the main loop directly through them via manifolds and pump at each rack? You can still enclose the mainbaord and cooling block in a sealed, insulated compartment to eliminate condensation problems, but not being submerged means you can actually repair/upgrade the modules.
=Smidge=