Samsung '3D' Memory Coming, 50% Denser

CWmike writes "Samsung on Tuesday announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared with conventional DIMM technology. Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry. The new memory module is aimed at the server and enterprise storage markets. The three-dimensional (3D) chip stacking process is referred to in the memory industry as Through Silicon Via (TSV). Samsung said the TSV process saves up to 40% of the power consumed by a conventional RDIMM. Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems."

Comments

TIME TO BRING BACK CORE !!

[Anonymous Coward]

Core memory is static in the true sense of the word. I've got core memory that hasn't changed a bit in 60 years. Punks !! You don't know memory.

Re:TIME TO BRING BACK CORE !!

[StormUP]

Sounds really slow. When do you expect the bit to finish changing?

Re:Oh great. Dense memory.

[martas]

That's the spirit, let it all out! We're happy to hear to the woes of the few among us who have ever had social contact with the opposite sex ;]

Re:Saves up to 40% power savings?

[Ailure]

Trust me, DRAM power consumption is becoming a serious probpem.

So is apparently cosmic rays. ;)

Re:Saves up to 40% power savings?

[tom17]

640W should be enough power for anybody.