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Samsung '3D' Memory Coming, 50% Denser
CWmike writes "Samsung on Tuesday announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared with conventional DIMM technology. Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry. The new memory module is aimed at the server and enterprise storage markets. The three-dimensional (3D) chip stacking process is referred to in the memory industry as Through Silicon Via (TSV). Samsung said the TSV process saves up to 40% of the power consumed by a conventional RDIMM. Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems."
Googling a bit, one test showed 2x1 GB of memory consuming up to 7.28 watts.
http://www.tomshardware.com/reviews/hardware-components,1685-13.html
For PC, that's practically nothing. For mobile devices, every watt counts.
Sounds really slow. When do you expect the bit to finish changing?
Not just mobile. Newer generations of HTPCs, Plug like devices are using 20W.
Yeah, I measured my MythTV frontend at 26W from the wall; so if the 4GB of RAM is taking 14W, that would be more than half the total consumption of the entire system.
Additionally, an average server has 2x cpus, 8x memory, while having 0x graphics compared to an average desktop. Another problem is that we are running out of tricks for reducing dram power, which means that the portion of dram power may increase steadily in the near future.
Even graphic cards have a sizable, high-bandwidth ram on-board.
Trust me, DRAM power consumption is becoming a serious probpem.