Fabs Now Manufacturing Carbon Nanotube Memory, Which Could Replace NAND and DRAM

Lucas123 writes: Nantero, the company that invented carbon nanotube-based non-volatile memory in 2001 and has been developing it since, has announced that seven chip fabrication plants are now manufacturing its Nano-RAM (NRAM) wafers and test chips. The company also announced aerospace giant Lockheed Martin and Schlumberger Ltd., the world's largest gas and oil exploration and drilling company, as customers seeking to use its chip technology. The memory, which can withstand 300 degrees Celsius temperatures for years without losing data, is natively thousands of times faster than NAND flash and has virtually infinite read/write resilience. Nantero plans on creating gum sticks SSDs using DDR4 interfaces. NRAM has the potential to create memory that is vastly more dense that NAND flash, as its transistors can shrink to below 5 nanometers in size, three times more dense than today's densest NAND flash. At the same time, NRAM is up against a robust field of new memory technologies that are expected to challenge NAND flash in speed, endurance and capacity, such as Phase-Change Memory and Ferroelectric RAM (FRAM).

Comments

Interesting process

[drhank1980]

Looking at the pictures in the slides this looks very similar to a carbon nanotube memory process I worked on at my last job (we might have even been licensing some of the IP from these guys). We were looking for a way to shrink our microcontroller die by moving the EEPROM cells up into the metallization stacks. An additional benefit to this memory was that we would be able to increase the EEPROM memory size 2x (with a second layer of cells) with the addition of just 5 more masking layers and almost no increase in die size.

The process I worked on was nowhere near volume production when I left; but I do know we did have completely functional die with carbon nanotube memory. The one part of the process that was most challenging was dealing with the carbon nanotube spin on process. It took forever to get the right thickness uniformity and once you had it at the correct thickness you were rewarded with a material that had filled in your lithography alignment structures to the point they were almost worthless for the next patterning step. It was pretty cool tech to work on, I am glad it looks like somebody is getting it to work.