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Intel Skylake CPUs Are Warping Under Mounting Pressure From Third-Party Coolers (hothardware.com)
MojoKid writes: It's been discovered that some third-party heat sinks can physically damage Intel's new Skylake CPUs, along with the pins in the accompanying motherboard socket. The problem has prompted at least one cooler maker to change the design of its Socket 1151 heat sinks and it wouldn't be surprising if others soon followed suit. The apparent issue is the substrate Intel used for its Skylake chips. A close-up shot of a Skylake CPU sitting side-by-side with a Broadwell processor (Google translation of German original) shows that the substrate is noticeably thinner on Skylake, and thus prone to bending from the force that some third-party heat sinks exert.
Intel has addressed the issue by saying, “The design specifications and guidelines for the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations and are available for partners and 3rd party manufacturers. Intel can’t comment on 3rd party designs or their adherence to the recommended design specifications. For questions about a specific cooling product we must defer to the manufacturer.”
Great, now all we need to do is build the rest of the starship
Likely they're intentionally trying to deform the surface to fit, and to compress and thin the thermal paste.
You want a thin, fully-contacted surface to maximize thermal transfer. Intel likely made the substrate thinner to increase thermal transfer: 1 inch of highly-thermally-conductive silver is a better insulator than 1 micrometer of highly-thermally-conductive silver (hell, a mile of silver wire is a better electrical resistor than a layer of silver foil stuffed between two terminals). Silicone substrate isn't particularly thermally conductive, and thick silicone substrate is even less so.
Because the CPU surface isn't perfectly flat but *is* flexible, pressure will help conform it to the (also not perfectly flat) heat sink surface. This squeezes some of the thermal paste away, and compresses out voids to increase contact surface area. If you assume more is better, you'll naturally conclude that crushing the CPU into dust will give you better contact.
If Intel puts out a specification saying 50psi is rated contact pressure for correct heat sink function, you might decide to put 90psi on it. It works. You ship that, Intel releases a CPU that can handle 70psi instead of 140psi, they don't bother telling anyone because the CPU's spec is still 50psi, and shit starts breaking.
Amusingly, Intel could have glibly put every cooling system manufacture on a list of warranty-terminating equipment ages ago. They could have said, "Hey, we tested all these EXXXTREME COOLING jet fans and they dump 120psi onto our chips like the Hulk putting our balls in a vice. You strap that to the CPU and it fails, we're not responsible." It's fair for Intel to claim that unknown third-party equipment can destroy their hardware; can they quality control third-party equipment? They could, and they could stamp their name on it. That's how motherboards are made, and the board manufacturer is still liable if their board is mis-manufactured (now, if Intel passes the design and the design is flawed, Intel's certification makes Intel liable--Intel is negligent here; if the manufacturing is not within tolerance to produce properly-working equipment and it pumps out flawed boards, it's the manufacturer's fault).
These things happen. It sucks when they do.
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I think the the "K" version of the 6700 is the overclocked version so it does not come with a cooler as most overclockers will buy a 3rd party one. The poster had the non "K" version which is not meant to be overclocked.
Well, there's spam egg sausage and spam, that's not got much spam in it.
Look, oh_my_shittynumbers is being an idiot again.
The question isn't whether or not shit is thinner, it clearly is.
The question is whether:
A: Third party heatsinks are exceeding the limit (50 pounds) for mounting pressure.
B: Intel fucked up and the 50 pound limit needs to be lowered for the thinner shit.
C: Both A and B.
My guess is A.
The heatsink mounting pressure is way over limit for many third-party heatsinks, but the 50 pound limit was conservative for older Intel CPUs and they could handle a lot more. The newer CPUs can almost certainly handle the listed 50 pounds, and more, but not nearly as much as the older CPUs.
Anyone who has installed a large third-party heatsink knows that the fucking motherboard will flex and bend and you'll put a ton of fucking pressure on it when installing it and trying to get it latched/screwed/etc. properly. After installation you look at it and think "Uh, is this really okay? Should I switch to a horizontal configuration?". But you'll leave it vertical anyway.